Curved Stage Substrate Cutting for Display Device Manufacturing

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Solution Overview

Problem

Conventional substrate cutting apparatuses damage inorganic layers on substrates due to their vertical cutting method, which affects manufacturing efficiency in display device production.

Innovation Solution

A substrate cutting apparatus with a stage featuring curved and flat portions, where the cutting portion cuts the substrate at a position overlapping the curved portion, creating an inclined cut surface to prevent damage and allow for adjustable cutting angles without altering the stage or cutting tool orientation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional substrate cutting apparatus cuts a substrate with a vertical cross-section, then the cutting process is simple and straightforward, but the inorganic layer formed on the substrate may be damaged during the cutting process

Engineering Contradiction:
Improveintegrity of inorganic layerVSAvoidcutting apparatus structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The stage includes a curved portion that contacts the substrate during cutting. This curved surface allows the substrate to be inclined relative to the cutting portion, creating an oblique cut that prevents damage to the inorganic layer while maintaining a relatively simple apparatus structure without requiring complex stage or cutting tool inclination mechanisms

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

Only the specific region of the stage that contacts the substrate during cutting is curved, while other portions remain flat. This localized curvature provides the necessary oblique cutting capability without making the entire stage complex, resolving the contradiction between reliability improvement and device complexity

Inventive Principle:
Principle #3Local quality

2Reliability

If the stage or cutting tool is inclined to achieve oblique cutting, then the inorganic layer integrity is improved, but the device complexity and operation difficulty increase

Engineering Contradiction:
Improveintegrity of inorganic layerVSAvoidoperation simplicity
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The curved portion of the stage automatically provides the necessary inclination for oblique cutting through its geometry. The substrate naturally conforms to the curved surface during cutting, eliminating the need for complex stage or cutting tool inclination mechanisms and maintaining ease of operation

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The curved stage portion self-generates the required cutting angle through its geometry. The system uses the inherent shape of the curved surface to achieve oblique cutting without requiring external control mechanisms or complex operational adjustments, thereby maintaining operational simplicity

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents or reduces substrate damage during cutting, simplifies the manufacturing process by allowing oblique cutting without inclining the stage or cutting tool, and maintains the integrity of inorganic layers on the substrate.

Implementation Method 1

The stage may include a plurality of vacuum holes.

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS9502443B1Substrate cutting apparatus and method of manufacturing display device by using the same
Publication Date: 2016.11.22 SAMSUNG DISPLAY CO LTD
  • US9502443B1 patent drawing
  • US9502443B1 patent drawing
  • US9502443B1 patent drawing

AI summary

A substrate cutting apparatus includes: a stage configured to support a substrate and including at least one curved portion that extends along a first direction, and flat portions respectively on sides of the curved portion and continuous with the curved portion; and a cutting portion above the stage and configured to cut the substrate in a second direction and along the first direction at a position spaced from a central line of the curved portion in a third direction.