Curved Substrate Chuck for Laser Stealth Dicing
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Solution Overview
Problem
Mechanical cutting of semiconductor substrates often results in defects such as chipping, and existing laser cutting methods may cause physical damage to semiconductor chips due to high power requirements and scattering issues.
Innovation Solution
A substrate processing apparatus using a chuck table with a curved mounting surface that vacuum-adsorbs the substrate to modify its shape and a laser supply head that focuses a laser beam to create a modification layer, allowing for stealth dicing by propagating cracks within the substrate without damaging integrated circuit regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical cutting using a sawing blade is used, then the substrate can be cut, but defects such as chipping occur in the semiconductor chip
Solution Approach 1:
The patent replaces the mechanical sawing blade cutting system with a laser beam-based cutting system. The laser beam irradiates the substrate to form a modification layer that propagates cracks along the cutting line, separating the substrate without mechanical contact. This substitution eliminates the chipping defects caused by mechanical blade contact while maintaining effective cutting capability.
2Productivity
If high power laser beam is used for cutting, then the substrate can be cut, but physical damage occurs to the semiconductor chip
Solution Approach 1:
The patent applies local quality by creating a modification layer only at the specific location where the laser beam irradiates the substrate, rather than applying high power uniformly across the entire substrate. The modification layer forms localized cracks along the cutting line, enabling cutting with lower overall laser power and preventing widespread physical damage to the semiconductor chip.
Solution Approach 2:
The patent changes the laser beam parameters by using a wavelength that the substrate material absorbs effectively, allowing cutting to be achieved with lower power. The modification layer formation process alters the local physical properties of the substrate, enabling crack propagation at reduced energy levels compared to traditional high-power laser cutting methods.
3Manufacturing precision
If laser beam is used for cutting, then physical damage is reduced, but the laser power required is high
Solution Approach 1:
The patent changes the laser beam parameters by selecting a wavelength that matches the absorption characteristics of the substrate material. This parameter optimization allows the laser to be absorbed more efficiently by the substrate, forming the modification layer with lower power requirements. The wavelength selection enables reduced energy consumption while maintaining the chip integrity benefits of laser cutting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the risk of chipping and physical damage by using a low-power laser to form cracks in the substrate, enhancing productivity and reducing the number of cutting operations while maintaining chip integrity.
Implementation Method 1
the substrate is vacuum adsorbed on the mounting surface so that the substrate is modified to have a curvature corresponding to a curvature of the mounting surface
Implementation Method 2
a laser supply head configured to irradiate the substrate mounted on the mounting table with a laser beam
Implementation Method 3
the laser supply head irradiates a focusing point in the substrate modified by the chuck table with the laser beam
Data Source
AI summary
A substrate processing apparatus includes a chuck table including a mounting table having a mounting surface on which a substrate is mounted, wherein the mounting surface is a curved surface; and a laser supply head configured to irradiate the substrate attached to the mounting table with a laser beam.