Curved Tip Pressing Member for Semiconductor Wafer Cleavage

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Solution Overview

Problem

Existing methods for manufacturing semiconductor light-emitting elements with non-rectangular shapes, such as hexagonal shapes, are inefficient due to the need for precise positioning of linear break blades, which can damage the elements and complicate the cleaving process.

Innovation Solution

A method involving a semiconductor wafer with a cleavage starting portion formed by laser scribing, allowing for the use of a pressing member with a curved tip to efficiently cleave the wafer into polygonal light-emitting elements, reducing damage and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a linear break blade is used to cleave the semiconductor wafer, then the cleaving operation can be performed with a simple linear tool, but the light-emitting elements may be damaged when the scribe line is bent (non-rectangular shapes)

Engineering Contradiction:

Improvesimplicity of cleaving operationVSAvoiddamage to light-emitting elements

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The pressing member is equipped with a curved pressing surface instead of a linear blade edge. This curved surface can conform to bent scribe lines and non-rectangular element shapes, allowing the pressing force to be applied uniformly along the curved cleavage path without damaging the light-emitting elements. The curvature enables adaptation to various element geometries while maintaining manufacturing simplicity.

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Reliability

If a small blade of the same size as the light-emitting element is used, then damage to elements can be avoided, but the positioning operation becomes complicated and time-consuming

Engineering Contradiction:

Improveprotection of light-emitting elementsVSAvoidpositioning time during cleaving operation

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The pressing member's curved pressing surface is designed with specific geometric characteristics that allow it to span multiple elements while applying pressure only at the cleavage locations. This segmentation of the pressing function enables a single larger pressing member to replace multiple smaller blades, reducing positioning complexity and time while maintaining element protection through the curved surface geometry.

Inventive Principle:

Principle #1Segmentation

3Productivity

If the break blade is pressed against the semiconductor wafer at portions except the scribe line, then the wafer can be cleaved, but the light emitting element may be damaged

Engineering Contradiction:

Improvecleaving operation efficiencyVSAvoiddamage to light emitting element

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The curved pressing surface of the pressing member is designed to concentrate the pressing force locally at the scribe line positions while distributing the overall pressure along the curved path. This local quality control ensures that cleaving occurs precisely at the intended scribe lines without damaging adjacent light-emitting elements, as the curved surface geometry naturally directs forces to appropriate locations based on the element layout.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient cleavage of semiconductor wafers into polygonal light-emitting elements with reduced damage and increased manufacturing efficiency, improving the yield and quality of non-rectangular shaped semiconductor elements.

Implementation Method 1

dividing the semiconductor wafer into a plurality of semiconductor elements by transferring the pressing member on the semiconductor wafer in a state where the pressing member is pressed against the semiconductor wafer to separate the semiconductor wafer at the cleavage starting portion

Methodology Applied

Scientific EffectFracture Mechanics: Fracture Mechanics

Implementation Method 2

The pressing member includes a tip portion having a curved surface to be pressed on the semiconductor wafer

Methodology Applied

Scientific EffectStress distribution: Stress Relaxation

Data Source

PatentUS10388827B2Method for manufacturing semiconductor element by dividing semiconductor wafer using pressing member having tip portion

Publication Date: 2019.08.20 NICHIA CORP

AI summary

A method for manufacturing a semiconductor element is provided. The method includes providing a semiconductor wafer including a substrate and a semiconductor structure on the substrate, forming a cleavage starting portion in the semiconductor wafer, and dividing the semiconductor wafer into a plurality of semiconductor elements by transferring a pressing member on the semiconductor wafer in a state where the pressing member is pressed against the semiconductor wafer to separate the semiconductor wafer at the cleavage starting portion. The pressing member includes a tip portion to be pressed on the semiconductor wafer, and the tip portion has a spherical surface.