Curved Top-Plate Capacitor Structure for Higher Breakdown Voltage

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Solution Overview

Problem

Existing capacitors suffer from dielectric breakdown due to sharp corners on the top-plate, leading to high E-field concentrations and reduced dielectric breakdown voltage, while thicker insulators to mitigate this issue decrease capacitance, affecting functional performance.

Innovation Solution

Implementing a curved topology for the top-plate with raised edges and a thinner center to disperse the electric field, combined with varying dielectric materials to maintain capacitance and enhance dielectric breakdown performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a flat top-plate with sharp corners is used, then manufacturing is simple, but dielectric breakdown occurs due to high E-field concentration

Engineering Contradiction:
Improvetop-plate fabrication simplicityVSAvoiddielectric breakdown voltage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The top-plate transitions from sharp corners to curved edges with a specified radius of curvature. This curvature distributes the electric field lines more evenly across the plate edges, eliminating the concentrated E-field peaks that cause dielectric breakdown. The curved geometry maintains manufacturing feasibility while significantly improving high voltage reliability.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If the insulator thickness is increased to prevent dielectric breakdown, then dielectric strength improves, but capacitance decreases

Engineering Contradiction:
Improvedielectric breakdown voltageVSAvoidcapacitance
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The insulator thickness is optimized locally: thicker regions are positioned specifically at the curved edges of the top-plate where E-field concentration occurs, while the central region maintains optimal thickness for capacitance. This localized differentiation allows the structure to withstand high voltages at critical points without unnecessarily reducing overall capacitance.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the top-plate has uniform thickness, then manufacturing is easier, but E-field distribution is uneven causing breakdown

Engineering Contradiction:
Improvetop-plate fabrication simplicityVSAvoidE-field concentration
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The top-plate incorporates curved edges with a controlled radius of curvature instead of sharp corners. This geometric modification fundamentally changes the E-field distribution pattern, transforming concentrated field lines at sharp edges into evenly distributed field lines along the curved perimeter, thereby eliminating the harmful E-field concentration effect.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The curved top-plate design reduces peak electric field magnitude, increasing dielectric breakdown voltage and maintaining capacitance, thus improving high voltage isolation and operational reliability.

Implementation Method 1

the curved top-plate design reduces peak electric field magnitude, increasing dielectric breakdown voltage

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

High voltage capacitance applications such as galvanic isolation, energy storage in electric circuits

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentEP4645356A1High voltage capacitance device
Publication Date: 2025.11.05 NXP BV
  • EP4645356A1 patent drawingFigure 1
  • EP4645356A1 patent drawingFigure 2
  • EP4645356A1 patent drawingFigure 3A~3b

AI summary

One example discloses a capacitance device, including: a substrate; a bottom-plate coupled to the substrate; an insulator coupled to the bottom-plate; and a top-plate coupled to the insulator; wherein the top-plate includes a flat portion and a curved portion.