CVD Diamond Coring and Slicing with a Laser-Guided Fluid Jet
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Solution Overview
Problem
Conventional methods for coring and slicing CVD diamonds are lengthy, inaccurate, and result in significant waste and poor quality slices due to the hardness of diamonds and the thickness of graphitized layers.
Innovation Solution
A fully automatic method and apparatus using a laser beam coupled into a fluid jet for coring and slicing CVD diamonds, allowing for precise removal of graphitized material and cutting of diamond slices with minimal taper and constant kerf width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional coring and slicing methods are used, then the process can be performed with existing equipment, but the processing time is lengthy and productivity is low
Solution Approach 1:
The patent combines coring and slicing operations into a single integrated process using laser technology. The laser beam performs both coring (removing graphitized material) and slicing (cutting diamond slices) without requiring separate mechanical operations, thereby significantly reducing processing time and improving productivity.
Solution Approach 2:
The patent replaces conventional mechanical coring and slicing equipment with a laser-based system. The laser beam eliminates the need for mechanical contact with the diamond, avoiding the time-consuming nature of mechanical operations while achieving precise coring and slicing simultaneously.
2Manufacturing precision
If conventional coring methods are used, then existing equipment can be utilized, but coring accuracy is limited and material waste increases
Solution Approach 1:
The patent replaces mechanical coring tools with a laser beam that can precisely remove graphitized material without the inaccuracies inherent in mechanical methods. The laser's focused energy allows for exact coring paths, minimizing material waste while achieving high coring accuracy.
Solution Approach 2:
The patent utilizes the laser beam's controllable parameters (power, duration, focal point) to achieve precise coring. By adjusting these parameters, the system can accurately remove only the graphitized material without affecting the diamond quality, thereby reducing material waste.
3Manufacturing precision
If conventional slicing methods are used, then mechanical slicing equipment can be employed, but the hardness of diamond and thickness of graphitized layers make slicing difficult and slice quality poor
Solution Approach 1:
The patent replaces mechanical slicing equipment with a laser-based slicing system. The laser beam can easily cut through the diamond and graphitized layers without being hindered by their hardness or thickness, producing high-quality slices with smooth surfaces and no micro-cracks.
Solution Approach 2:
The laser beam induces phase transitions in the material being sliced, vaporizing or melting the graphitized layers and diamond along the cut path. This phase change mechanism allows the laser to slice through hard materials without mechanical contact, overcoming the difficulties of conventional mechanical slicing.
4Manufacturing precision
If conventional slicing methods are used, then mechanical slicing can be performed, but slice parallelism and surface roughness are poor
Solution Approach 1:
The patent replaces mechanical slicing with laser slicing, which inherently produces parallel slices with smooth surfaces. The laser beam's consistent focal point and controlled movement ensure uniform cut depth and parallelism, while the laser's precise energy delivery creates smooth cut surfaces without the roughness associated with mechanical slicing.
Solution Approach 2:
The laser system's controllable parameters (beam width, power distribution, scanning speed) are optimized to produce parallel slices with excellent surface finish. By maintaining consistent laser parameters throughout the slicing process, the system achieves high slice parallelism and smooth surfaces, improving overall slice quality and reliability.
5Reliability
If conventional methods are used, then existing equipment can process diamond, but micro-cracks often deteriorate slice quality
Solution Approach 1:
The patent replaces mechanical slicing with laser slicing, which eliminates the mechanical stresses that cause micro-cracks. The laser beam's non-contact energy delivery vaporizes or melts material without applying mechanical force, thereby preventing the formation of micro-cracks and improving slice quality and reliability.
Solution Approach 2:
The laser-induced phase transitions (vaporization or melting) allow material removal without mechanical contact. This phase change process avoids the mechanical stresses and impacts that would otherwise create micro-cracks, resulting in crack-free slices with improved quality and reliability.
6Productivity
If conventional slicing is used, then a limited number of slices can be obtained, but the thickness of slices must be maintained above a certain limit
Solution Approach 1:
The laser slicing system can produce much thinner slices compared to mechanical methods. The laser's precise energy concentration allows for cutting extremely thin layers without the mechanical constraints that limit slice thickness in conventional slicing, thereby enabling a larger number of slices to be obtained from each diamond.
Solution Approach 2:
By adjusting the laser parameters (power, pulse duration, scanning speed), the system can control the thickness of each slice with high precision. This parameter control enables the production of uniformly thin slices, maximizing the number of slices that can be obtained from a single diamond while maintaining acceptable quality.
7Extent of automation
If conventional coring and slicing are performed separately with intermediate manipulation, then each step can be optimized independently, but the overall process time increases and automation is reduced
Solution Approach 1:
The patent merges coring and slicing into a single automated laser-based process. The laser system performs both operations sequentially without requiring intermediate manipulation or repositioning of the diamond, achieving full automation and eliminating the time loss associated with manual handling between coring and slicing steps.
Solution Approach 2:
The laser-based system maintains continuous operation throughout the coring and slicing process. The laser beam remains focused and active, moving continuously from coring to slicing without interruption or manual intervention, thereby achieving full automation and eliminating idle time between operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces processing time, achieves high precision with parallel and smooth slices, reduces micro-crack occurrence, and allows for thinner slices than conventional methods, while minimizing material loss.
Implementation Method 1
the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond
Implementation Method 2
for the slicing, cutting off one or more slices from the diamond with the laser beam
Data Source
AI summary
The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.