Cyclic Silane Bridging Agent for Polyolefin Encapsulation Creep Resistance
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Solution Overview
Problem
The service life of electronic components is shortened due to the relatively low heat resistance and tensile resistance of existing encapsulating materials used in optoelectronic technologies.
Innovation Solution
A cyclic silane bridging agent with a specific structural formula is introduced, which improves compatibility and crosslinking with non-polar polyolefin resins, enhancing heat and tensile resistance through chemical crosslinking initiated by heat, light, and radiation, thereby forming a larger crosslinking structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyolefin materials are used as encapsulating materials, then insulation, water resistance, PID resistance, and acid-free corrosion resistance are improved, but heat resistance and tensile resistance deteriorate
Solution Approach 1:
The patent uses polyolefin resin as the base material and introduces silane crosslinking agents (such as methyl trimethoxysilane, methyl tetramethoxysilane, or dimethyl dimethoxysilane) to create a crosslinked composite structure. This composite approach combines the excellent insulation and corrosion resistance of polyolefin with the high heat and tensile resistance provided by the silane crosslinked network, thereby resolving the contradiction between insulation performance and heat resistance.
Solution Approach 2:
The patent changes the chemical structure parameter of the encapsulating material by introducing crosslinking degrees through silane agents. By controlling the crosslinking density and structure, the material transitions from a simple polyolefin chain to a three-dimensional crosslinked network, which significantly improves heat resistance and tensile resistance while preserving the insulation properties of the base polyolefin material.
2Reliability
If polyolefin materials are used as encapsulating materials, then insulation, water resistance, PID resistance, and acid-free corrosion resistance are improved, but tensile resistance deteriorates
Solution Approach 1:
The patent creates a composite structure where polyolefin resin forms the matrix and silane crosslinked networks provide reinforcement. The silane crosslinked structure acts as a reinforcing phase that significantly enhances tensile resistance while the polyolefin matrix maintains insulation performance, water resistance, and corrosion resistance, thus resolving the contradiction between insulation performance and tensile resistance.
Solution Approach 2:
By changing the molecular structure parameter through silane crosslinking, the patent transforms the linear polyolefin chains into a three-dimensional crosslinked network. This structural parameter change dramatically improves tensile resistance by creating a rigid network structure, while the hydrophobic nature of the polyolefin chains is preserved, maintaining insulation and water resistance properties.
3Duration of action of moving object
If encapsulating materials operate for long periods, then electronic components maintain functionality, but heat and deformation cause deterioration of encapsulating materials
Solution Approach 1:
The patent applies silane crosslinking agents in advance to the polyolefin resin before the encapsulating material is fully deployed. This pre-crosslinking creates a more stable molecular structure that can withstand long-term thermal and mechanical stress. The crosslinked network structure acts as a preventive measure against future deterioration from heat and deformation, thereby extending service life while maintaining material stability.
Solution Approach 2:
The patent creates a composite material system where the silane crosslinked network provides long-term structural stability and resistance to thermal degradation, while the polyolefin matrix maintains chemical inertness and resistance to environmental factors. This composite structure ensures that the encapsulating material can maintain its protective function over extended service periods without significant deterioration from heat and deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the creep resistance and service life of electronic components by enhancing the compatibility and crosslinking of encapsulating materials, reducing migration issues and extending the operational lifespan.
Implementation Method 1
the terminal double bond provided by the R1 substituent in the bridging agent molecule serves as a chemical crosslinking point, which may be chemically bonded with the molecular chain of the polyolefin resin under the initiation effects caused by heat, light, radiation and the like, thereby a larger crosslinking structure is formed
Implementation Method 2
under the initiation effects caused by heat, light, radiation and the like
Implementation Method 3
under the initiation effects caused by heat, light, radiation and the like
Data Source
AI summary
The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connected to Si atoms, and x+y is equal to the n; R1s are in pairwise alignment. R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged.