Cyclic-Solvent Thinner Composition for Photoresist EBR

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Solution Overview

Problem

Existing thinner compositions for semiconductor manufacturing cause issues such as high Hump height, reduced film uniformity, and increased defects due to high polarity, leading to reduced yield and efficiency in removing photosensitive films and anti-reflective coatings.

Innovation Solution

A thinner composition comprising a cyclic ketone-based compound and a cyclic hydrocarbon compound, which controls polarity and improves solubility and Edge Bead Removal (EBR) properties for KrF, ArF, and EUV photoresists and anti-reflective coatings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high polarity thinner composition is used to improve solubility and EBR properties, then dissolution rate and EBR performance are improved, but Hump height increases and film uniformity decreases

Engineering Contradiction:
ImproveEBR performanceVSAvoidfilm uniformity
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent changes the chemical composition parameters of the thinner by using a specific mixture ratio of PGMEA (70-90 wt%), EB (5-20 wt%), and OPG (1-10 wt%). This parameter optimization balances the polarity to achieve both high EBR performance and low Hump height, resolving the contradiction between dissolution rate and film uniformity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite thinner composition by combining three different solvents (PGMEA, EB, and OPG) with complementary properties. PGMEA provides base solubility, EB enhances EBR performance, and OPG controls swelling rate, achieving both high EBR performance and low Hump height simultaneously

Inventive Principle:
Principle #40Composite materials

2Productivity

If high polarity thinner composition is used to improve dissolution rate, then photosensitive resin removal efficiency is improved, but photoresist swelling speed increases causing higher Hump height

Engineering Contradiction:
Improvedissolution rateVSAvoidHump height
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent optimizes the composition parameters to contain OPG at 1-10 wt% which specifically controls the swelling rate of photoresist. This parameter adjustment maintains high dissolution rate through PGMEA while the OPG component moderates the swelling speed to prevent excessive Hump formation

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces OPG as an intermediary substance that mediates between the strong dissolving power of PGMEA and the photoresist material. OPG acts as a buffer that enables efficient dissolution while controlling the swelling kinetics, preventing rapid swelling that would cause high Hump height

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If rotation speed is reduced to low rpm due to substrate diameter enlargement, then coating uniformity is improved, but photosensitive film removal efficiency decreases

Engineering Contradiction:
Improvecoating uniformityVSAvoidfilm removal efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent changes the chemical parameters of the thinner composition to enhance its removal capability. The optimized mixture of PGMEA, EB, and OPG provides superior dissolution power that compensates for the reduced mechanical action from low rotation speeds, maintaining both coating uniformity and removal efficiency

Inventive Principle:
Principle #35Parameter changes

4Ease of operation

If high polarity thinner is used to improve EBR properties, then edge bead removal is enhanced, but film uniformity across the substrate decreases

Engineering Contradiction:
ImproveEBR propertiesVSAvoidfilm uniformity
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent precisely adjusts the polarity parameters by controlling the ratio of polar components (EB and OPG) to non-polar components (PGMEA). This parameter optimization ensures sufficient polarity for effective EBR while preventing excessive polarity that would cause non-uniform film formation, achieving both ease of operation and manufacturing precision

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively reduces Hump height, enhances film uniformity, and improves yield by controlling the swelling speed of photoresists, thereby minimizing defects in subsequent processes.

Implementation Method 1

A thinner composition comprising a cyclic ketone-based compound and a cyclic hydrocarbon compound, which controls polarity and improves solubility and Edge Bead Removal (EBR) properties

Methodology Applied
Scientific EffectSolvation: Solvation

Data Source

PatentUS20250271767A1Thinner composition for removing photosensitive resin and Anti-reflective coating, and method for removing photosensitive resin and Anti-reflective coating using the same
Publication Date: 2025.08.28 DONGWOO FINE CHEM CO LTD
  • US20250271767A1 patent drawing
  • US20250271767A1 patent drawing
  • US20250271767A1 patent drawing

AI summary

The present disclosure provides a thinner composition including a cyclic ketone-based compound and a cyclic hydrocarbon compound, and a method for removing a photosensitive resin and an anti-reflective coating using the same.