CYTOP Molding Part for UV LED Package Adhesion
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Solution Overview
Problem
Light emitting devices with ultraviolet wavelengths face issues with poor bonding between the body and quartz film due to adhesive damage, leading to reliability concerns and increased manufacturing costs.
Innovation Solution
A light emitting device package with a CYTOP-based molding part that transmits at least 90% of the ultraviolet wavelength, eliminating the need for a quartz film and enhancing adhesion and moisture-proofing, is used, along with a manufacturing method involving low-temperature deposition and drying of CF-based fluororesin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a quartz film and adhesive are used to protect the ultraviolet light emitting device, then the device is protected from environmental damage, but the adhesive deteriorates due to ultraviolet photon exposure causing poor bonding and reliability degradation
Solution Approach 1:
The patent removes the adhesive layer from the packaging structure, replacing it with a molding part made of UV-resistant material that directly bonds to both the substrate and the protective film, eliminating the component susceptible to UV damage
Solution Approach 2:
The patent changes the material parameter of the protective component from adhesive (UV-sensitive) to molding part material (UV-resistant), maintaining protective function while eliminating UV-induced deterioration
2Reliability
If a quartz film and adhesive structure is used, then the light emitting device is protected, but the structure becomes more complex and manufacturing cost increases
Solution Approach 1:
The patent combines the protective film and bonding function into a single integrated molding part structure, eliminating the need for separate adhesive layers and simplifying the overall packaging configuration
Solution Approach 2:
The molding part serves multiple functions simultaneously: structural protection, UV resistance, and bonding between components, replacing the specialized adhesive layer with a multi-functional element
3Reliability
If a quartz film and adhesive are used, then the device is protected, but manufacturing cost increases due to expensive materials and complex processes
Solution Approach 1:
The patent replaces expensive quartz film and adhesive materials with a cost-effective molding part made from UV-resistant polymer material that achieves the same protective and bonding functions at lower material cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light efficiency, durability, and reliability by preventing adhesive damage, reducing manufacturing costs, and enhancing moisture-proofing and chemical resistance, while simplifying the manufacturing process.
Implementation Method 1
a molding part accommodated in the cavity to protect the light emitting device, and the molding part may include a CYTOP... a CYTOP transmitting at least 90% of an ultraviolet wavelength
Implementation Method 2
depositing a CYTOP of a CF-based fluororesin on the light emitting device
Implementation Method 3
drying the CYTOP at a low temperature of 20° C. or less
Data Source
AI summary
An embodiment relates to a light emitting device package and a manufacturing method of the light emitting device package. The light emitting device package according to an embodiment may include a body having a top opened cavity, a light emitting device mounted on an inner bottom surface of the cavity, and a molding part accommodated in the cavity to protect the light emitting device, and the molding part may include a CYTOP, and thus not only light efficiency can be enhanced but also the reliability of the product can be improved with high durability.