Damping Particle Holding Device for Cutting Vibration Control
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Solution Overview
Problem
Cutting processes for large-volume objects often induce vibrations, resulting in rough and unsmooth surfaces of small-volume objects, particularly affecting high-precision components like ingots, leading to increased manufacturing costs and material loss.
Innovation Solution
A holding device with damping particles is integrated into cutting apparatuses, featuring accommodating cavities that attenuate vibrations through collision and friction, ensuring the object is held steadily and reducing surface warpage of cut pieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cutting apparatuses contact large-volume objects during cutting processes, then cutting can be performed, but vibrations are induced causing rough surfaces
Solution Approach 1:
The patent introduces damping particles as an intermediary substance between the cutting apparatus and the workpiece. These particles are contained within accommodating cavities in the holding device and serve to absorb and attenuate vibrations generated during cutting, thereby improving surface quality without interfering with the cutting process
Solution Approach 2:
The patent changes the physical state and parameters of the holding device by incorporating damping particles with specific material properties (viscoelasticity, damping capacity). This modifies the vibration characteristics of the system, transforming harmful vibrations into attenuated movements that protect the workpiece surface
2Manufacturing precision
If damping particles are added to reduce vibration, then surface quality improves, but device complexity increases
Solution Approach 1:
The damping particles are nested within accommodating cavities that are integrated into the holding device structure. This nested design allows the damping function to be incorporated without significantly increasing the external dimensions or overall complexity of the holding device, as the damping mechanism is contained within existing structural spaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The holding device effectively reduces vibrations during cutting, resulting in smoother surfaces of small-volume objects and maintaining the center of mass stability, thereby minimizing surface warpage and material loss.
Implementation Method 1
The plurality of damping particles performs collision and friction between each other or with a cavity wall of at least one accommodating cavity to attenuate vibrations
Implementation Method 2
The plurality of damping particles performs collision and friction between each other or with a cavity wall of at least one accommodating cavity to attenuate vibrations
Data Source
AI summary
A holding device applied to a cutting apparatus to hold an object to be cut includes a holding element and a plurality of damping particles. The holding element is used for holding the object to be cut, and the holding element includes at least one accommodating cavity. Each accommodating cavity extends inward from the outer surface of the holding element to form an accommodating space. The plurality of damping particles is placed in at least one accommodating cavity. During the cutting process of the object to be cut, the plurality of damping particles generates collision and friction with each other or with the cavity wall of the accommodating cavity to reduce the vibration generated by the object to be cut, thereby reducing the surface warpage of a plurality of small-volume objects formed after cutting the object to be cut.