Fine Working Devices TRIZ Cases

Sacrificial disks support ingot end faces during wire sawing to limit wafer breakage, improve yield, and reduce slicing losses.

Targeted inner and outer spray nozzles remove silicon micro powders from wire cutting machine parts, cutting manual cleaning time.

A simplified 81-facet round gemstone layout boosts brilliance and scintillation while improving weight retention and reducing cutting damage risk.

Detachable sprayer parts simplify cleaning, while adjustable positioning maintains slurry cooling as main roller wear shifts the wire saw contact point.

Distinct crown and pavilion facet angles balance brilliance with natural color enhancement in an elliptical-cut gemstone.

A laser-formed peeling layer starts cracks inside the wafer edge, enabling stable separation with less chipping and better material yield.

Tensile stress and an inner stress-concentrated peeling layer guide crack growth away from wafer edges to improve peeling stability and yield.

Dual cameras verify whether wafer cracks fully separate at each projected dicing line, enabling repeat pressing when division is incomplete.

An inclined c-axis can skew SiC wafer cuts; aligning the annular cutting edge with the planned plane supports accurate chip shapes.

A wedge-guided Vickers crack separates 500 μm SiC wafers, reducing kerf waste and polishing needs versus wire sawing.

Rear positioning of the feeding channel eliminates interference with human operators, allowing simultaneous loading and unloading without safety hazards.

Adjusting lower halves angles eliminates the green table effect in peripheral areas, ensuring optimal light return.

A four-stone princess cut diamond assembly creates a seamless large-area appearance through asymmetric culet positioning and merged facet alignment.

Laser scanning creates internal cracks in hexagonal ingots, reducing material waste from 80% to 30% during wafer production.

Pulsed laser processing forms internal breakable layers in silicon carbide ingots, reducing material discard and improving production speed.

Low temperature operation hardens polyurethane-resin coating layer to prevent swarf residue and eliminate multiple feeding steps during groove engraving.

Blade-abrasive-grain portion travels through a coolant pocket groove to supply cooling fluid directly at the cutting interface.

Supercritical carbon dioxide dissolves organic contaminants from silicon wafer grinding sludge, preventing oxidation during vacuum separation.

Overlapping picosecond laser pulses induce nonlinear absorption and thermal conduction, eliminating microcracks and material waste during substrate dicing.

Nested transfer assemblies automate head and tail material dumping, resolving the productivity versus device complexity contradiction in silicon rod cutting.

A wire saw regulates gaseous water content to stabilize slurry viscosity and maintain consistent cutting performance.

Laser processing forms modified layers and connection layers inside silicon carbide ingots to separate wafers while reducing material waste.

Converging multiple laser beams at separated positions along a line to form modified spots without overlap.

Segmenting the support member into flat and defining parts resolves the contradiction between deep scribe depth and plate integrity by localizing bending.

Holding device with damping particles attenuates cutting vibrations through internal collision and friction mechanisms.

A laser control method uses auxiliary heat sources to balance thermal stress during optical cutting of glass work pieces.

Parabolic focal point control reduces ingot discard by 30% while maintaining high wafer production efficiency.

Laser beam creates internal separation layer in beta gallium oxide workpiece, reducing 60% material wastage from wire saw cutting.

A concave sawing strip cradles cylindrical workpieces to constrain wire lateral deflection during abrasive cutting.

Reversing wire rotation compensates for thermal-induced undulations during semiconductor wafer slicing.

A cutting apparatus uses a pressure gauge to verify suction force before blade rotation.

Oscillating nozzles spray liquid to excite wire saw slices into vibration, eliminating stick-and-slip movements that cause notches and wire tears.

Segmented facet arrangements balance brilliance with color enhancement, resolving the trade-off between optical performance and manufacturing feasibility.

A repaired wire saw uses a dummy workpiece to wear the new line to the original diameter before slicing.

A gemstone design segments crown and pavilion facets to optimize light reflection paths.

Controller-adjusted support rails eliminate rocking gaps, enabling accurate image acquisition of processed states.

A mechanical scoring process separates chemically strengthened glass sheets using controlled vent lines and uniform bending moments.

Segmented laser pulses create discrete filament formations to prevent spontaneous breakage and improve edge strength.

A sacrificial support made of biodegradable polymer material dissolves in solvent to separate silicon powder from the cutting mixture.

Axicon lens modulation creates juxtaposed converging points along the irradiation direction, reducing fractures while preventing surface damage.

Rough micro-structures on the light-transmitting substrate enhance light extraction, resolving semiconductor layer damage and production cost issues.

Backside recessed portions guide wafer dicing to maintain element substrate dimensional accuracy.

Controlled pyrolysis at 400-600°C decomposes binders to recover abrasive grains without degrading their original structural integrity.

Auxiliary scribe lines spaced from the main line prevent chips and splits at the outer peripheral contour.

Roughening sapphire surfaces enables laser energy absorption, resolving tool wear and processing speed bottlenecks.

A wire mesh monitoring system calculates jumping values from position heights to detect cutting wire abnormalities.

Automated carrier positioning between series-mounted saws reduces manual handling steps and improves throughput.

Exit sawing at the pulling edge reduces wafer warp values by an order of magnitude, resolving surface irregularities caused by entry sawing relative movement.

Ultrafast laser pulses create internal filaments for precise diamond machining, reducing waste and surface roughness compared to ablative methods.