Under-Wire Spray Nozzle Assembly for Silicon Powder Cleaning
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Solution Overview
Problem
Conventional cleaning methods for silicon wafer cutting machines are labor-intensive and time-consuming, leading to reduced production capacity due to the accumulation of silicon micro powders on critical components like the feed stage and clamping mushroom head, which are difficult to clean effectively using existing methods.
Innovation Solution
An under-wire spray cleaning device with a trough body and spray assembly featuring internal and external nozzles that target specific components for efficient cleaning, utilizing a press-fit fastener system to enhance water pressure and coverage, allowing for automated cleaning without manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual cleaning or RO water gun is used to clean silicon micro powders from feed stage and clamping mushroom head, then cleaning can be performed, but it consumes excessive labor and time, reducing production capacity
Solution Approach 1:
The cleaning device enables self-service cleaning through automated spray nozzles that clean the feed stage and clamping mushroom head without requiring manual intervention. The system uses self-contained water storage tanks and pump mechanisms to generate and distribute cleaning water, allowing the equipment to clean itself during or between cutting operations.
Solution Approach 2:
The invention employs hydraulic principles by using water pumps to generate pressurized water flow through spray nozzles. The system includes water storage tanks connected to pump mechanisms that deliver high-pressure water streams to remove silicon micro powders from critical components, replacing manual cleaning methods with automated hydraulic spraying.
2Manufacturing precision
If regular cleaning intervals are implemented to maintain cleanliness of feed stage and clamping mushroom head, then cutting quality can be maintained, but production capacity is reduced due to frequent cleaning stops
Solution Approach 1:
The cleaning device performs preliminary cleaning actions by continuously or periodically spraying water on the feed stage and clamping mushroom head during cutting operations. This prevents silicon micro powders from accumulating to levels that would affect cutting quality, eliminating the need for complete production stops and enabling maintenance of precision without sacrificing productivity.
Solution Approach 2:
The system enables continuous cleaning action through automated spray mechanisms that operate during cutting processes. Water is continuously supplied through pumps and nozzles to maintain cleanliness of critical components throughout production, allowing both high cutting quality and sustained production capacity without intermittent cleaning stops.
3Ease of operation
If entire processing house is cleaned to clean important parts, then thorough cleaning is achieved, but excessive time and labor are consumed
Solution Approach 1:
The cleaning device applies local quality by targeting spray nozzles specifically at critical components such as the feed stage and clamping mushroom head where silicon micro powders accumulate and affect cutting quality. Rather than cleaning the entire processing house, the system concentrates cleaning resources on specific high-impact areas, achieving effective cleaning with minimal time and labor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly improves cleaning efficiency, reduces human labor, maintains machine cleanliness, and ensures consistent cutting quality by effectively removing impurities with enhanced water pressure and targeted spraying, thereby enhancing production capacity.
Implementation Method 1
a spray assembly connected to a trough body, wherein the trough body is entirely disposed in an engaging slot of a nozzle pipe device; wherein the spray assembly comprises first nozzles disposed on an inside of the trough body and second nozzles disposed on an outside of the trough body
Data Source
AI summary
The present disclosure provides an under-wire spray cleaning device for a wire cutting machine including: a spray assembly connected to a trough body, wherein the trough body is entirely disposed in an engaging slot of a nozzle pipe device; wherein the spray assembly includes first nozzles disposed on an inside of the trough body and second nozzles disposed on an outside of the trough body, the first nozzles are configured to clean a feed machine and a clamping mushroom head, and the second nozzles are configured to clean a sheave of the outside of the trough body. An advantage of the present disclosure is changing manually cleaning to cleaning by a spray device, which drastically improves cleaning efficiency and also prevents influence of human factors to cleanliness of the machine.