Sacrificial Disk Support for Wafer Breakage Control in Ingot Slicing

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Solution Overview

Problem

Uncontrolled wafer breakage during the slicing of monocrystalline semiconductor ingots using a wire saw reduces the yield and increases manufacturing inefficiencies and costs.

Innovation Solution

The use of sacrificial disks positioned adjacent the longitudinal ends of the ingot during the slicing operation provides longitudinal support to the wafers, inhibiting uncontrolled breakage by compensating for stresses along cleavage planes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wire saw slicing operation is performed on monocrystalline semiconductor ingot, then wafers are produced from the ingot, but uncontrolled wafer breakage occurs during slicing

Engineering Contradiction:

Improvewafer production quantityVSAvoidwafer integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A sacrificial disk is introduced as an intermediary component between the wire saw and the longitudinal ends of the ingot. This sacrificial disk absorbs the uncontrolled breakage forces and stresses that would otherwise damage the wafers being sliced, allowing continuous production while protecting wafer integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sacrificial disk is designed as a disposable component that is intentionally sacrificed to prevent damage to more valuable components (the wafers). By using a low-cost sacrificial element, the system protects the high-value semiconductor wafers from breakage during the slicing operation.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If sacrificial disks are positioned adjacent to longitudinal ends of the ingot, then wafer breakage is inhibited, but device complexity increases

Engineering Contradiction:

Improvewafer integrityVSAvoidslicing system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The system is segmented by adding discrete sacrificial disks at specific locations (adjacent to longitudinal ends of the ingot) rather than modifying the entire slicing system. This localized segmentation approach protects wafers where breakage is most likely to occur without complicating the overall device architecture.

Inventive Principle:

Principle #1Segmentation

3Productivity

If sacrificial disks are used to support wafers during slicing, then manufacturing efficiency improves, but loss of substance increases due to sacrificial material consumption

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidsacrificial disk material consumption

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

The sacrificial disks are designed as low-cost, disposable components made from inexpensive material. The minimal material loss is acceptable because it prevents much larger losses of valuable semiconductor wafers, making the trade-off economically favorable despite the consumption of sacrificial material.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS12605863B2Methods for controlling wafer breakage during ingot slicing operations

Publication Date: 2026.04.21 GLOBALWAFERS CO LTD

AI summary

A method of slicing wafers from a monocrystalline semiconductor ingot includes attaching a circumferential edge of the ingot to a bond beam and positioning sacrificial disks adjacent longitudinal end faces of the ingot. One sacrificial disk is positioned adjacent each of the longitudinal end faces. The method also includes connecting the bond beam to a wire saw that includes a wire web and performing a slicing operation on the ingot by operating the wire saw to drive the wire web and move the bond beam and the ingot in a movement direction towards the wire web to slice the wafers from the ingot. The sacrificial disks operate to inhibit uncontrolled breakage of the wafers during the slicing operation.