Groove Engraving Device Temperature Control Silicon Wafer
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Solution Overview
Problem
The existing silicon wafer cutting techniques using diamond wires face inefficiencies due to the deformation of polyurethane-resin coating layers at room temperature, requiring multiple processing steps and leaving residue, which affects the quality and speed of groove engraving.
Innovation Solution
A groove engraving device with a processing chamber, clamping mechanism, and temperature control system that maintains a preset temperature range, allowing the cutter to engrave grooves efficiently and prevent swarf residue by ensuring the piece's higher hardness during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cutter feeds multiple times to engrave the accommodation groove on the polyurethane-resin coating layer at room temperature, then the groove shape can be trimmed, but the processing time is long and the efficiency is low
Solution Approach 1:
The patent changes the temperature parameter from room temperature to low temperature (below 0°C), which fundamentally alters the material properties of the polyurethane-resin coating layer. At low temperature, the coating layer becomes sufficiently hard to be engraved in one step without deformation, eliminating the need for multiple feeding operations while maintaining groove precision.
Solution Approach 2:
The patent applies preliminary cooling to the coating layer before the engraving operation. By pre-cooling the polyurethane-resin coating layer to below 0°C, the material is prepared in advance to resist deformation during cutting, allowing the groove to be engraved in a single operation without subsequent trimming steps.
2Manufacturing precision
If the cutter feeds multiple times to engrave the accommodation groove, then the groove can be formed, but polyurethane resin remains at the groove bottom and cannot be cut off easily
Solution Approach 1:
The patent changes the temperature parameter to below 0°C, which fundamentally alters the material properties of the polyurethane-resin coating layer. At low temperature, the coating layer becomes sufficiently hard to be engraved in one step without deformation, eliminating the need for multiple feeding operations while maintaining groove precision.
Solution Approach 2:
The patent applies preliminary cooling to the coating layer before the engraving operation. By pre-cooling the polyurethane-resin coating layer to below 0°C, the material is prepared in advance to resist deformation during cutting, allowing the groove to be engraved in a single operation without subsequent trimming steps.
3Adaptability or versatility
If the coating layer is made of polyurethane-resin for flexibility, then the home roll can accommodate diamond wire, but the coating layer deforms easily during groove cutting at room temperature
Solution Approach 1:
The patent changes the temperature parameter from room temperature to below 0°C, which fundamentally alters the material properties of the polyurethane-resin coating layer. At low temperature, the coating layer becomes sufficiently hard to be engraved in one step without deformation, eliminating the need for multiple feeding operations while maintaining groove precision.
Solution Approach 2:
The patent exploits the dynamic property of polyurethane-resin that its hardness can be changed by temperature. The coating layer maintains flexibility at higher temperatures for wire accommodation but becomes hard at low temperatures for precise groove engraving, allowing the same material to serve dual purposes under different thermal conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces processing time and improves efficiency by allowing grooves to be formed in one step, enhancing the quality of groove engraving and facilitating better diamond wire arrangement on silicon wafers.
Implementation Method 1
a temperature controlling device for controlling a temperature inside the processing chamber to be within a preset temperature range
Implementation Method 2
a cooling device for cooling the piece to be processed, wherein the cooling device is disposed inside the processing chamber, and the cooling device is provided correspondingly to the cutter
Data Source
AI summary
A groove engraving device and a groove engraving method are provided. The groove engraving device includes: a processing chamber for containing a piece to be processed, a cutter for groove engraving on the piece to be processed, a clamping mechanism for clamping the piece to be processed, a driving mechanism for driving the clamping mechanism to rotate, and a temperature controlling device for controlling a temperature inside the processing chamber to be within a preset temperature range. The clamping mechanism and the cutter are disposed inside the processing chamber, and the clamping mechanism is rotatable with respect to the processing chamber. The temperature controlling device is disposed inside the processing chamber. The groove engraving device can improve the processing efficiency and quality of the groove engraving on the piece to be processed.