Optical Cutting Control Method for Glass Thermal Stress Management

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Solution Overview

Problem

Existing methods for cutting glass, such as mechanical machining and thermal laser cutting, face challenges with residual stress, swarf generation, and difficulty in controlling cutting paths, leading to suboptimal cutting surfaces and increased processing time and cost, especially for large-size glass and non-flat shapes.

Innovation Solution

A control method for optical cutting that determines a thermal cracking cutting path and uses auxiliary heat sources to balance undesired thermal stress, ensuring the actual cutting path aligns with the predetermined path and improving surface quality by analyzing thermal stress distribution and adjusting irradiation conditions for both cutting and auxiliary heat sources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If thermal cracking method is used for glass cutting, then swarf generation is reduced and processing steps are simplified, but cutting path control accuracy deteriorates and cutting surface quality becomes difficult to control

Engineering Contradiction:
Improveprocessing stepsVSAvoidcutting path control accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-calculating the thermal stress distribution of the workpiece before cutting, and pre-determining the auxiliary heating parameters based on this analysis. This allows the cutting process to compensate for thermal effects in advance, improving cutting path accuracy while maintaining the simplified thermal cracking process

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes parameters by introducing auxiliary heating parameters (heating power, heating speed, heating position) that can be adjusted to control the thermal stress distribution. By dynamically adjusting these parameters during cutting, the system maintains high precision cutting path control while using the thermal cracking method

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If auxiliary heat sources are added to balance thermal stress, then cutting path precision is improved, but device complexity increases

Engineering Contradiction:
Improvecutting path precisionVSAvoidsystem structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies universality by designing the auxiliary heating system to serve multiple functions: it not only balances thermal stress during cutting but also pre-heats the workpiece to reduce thermal shock and post-processing the cut edges. This multi-functionality reduces the need for separate processing steps and equipment

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent replaces mechanical measurement and adjustment systems with a computational approach. Instead of using complex mechanical devices to physically measure and adjust cutting parameters in real-time, the system uses numerical analysis to calculate thermal stress distribution and controls auxiliary heating through software, simplifying the physical device structure

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If numerical analysis method is used to analyze thermal stress distribution, then cutting quality is improved, but processing time increases

Engineering Contradiction:
Improvecutting qualityVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by performing the numerical analysis of thermal stress distribution before the actual cutting process. This pre-calculation allows the system to determine optimal auxiliary heating parameters in advance, so that during the actual cutting operation, no additional real-time calculation time is required, thus not increasing total processing time

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies self-service by creating a self-adjusting system where the pre-calculated thermal stress distribution automatically guides the auxiliary heating parameters. The system uses its own computational results to control the heating process without requiring external intervention or iterative adjustments, improving efficiency

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the precision and quality of the cutting surface, reducing deviations and swarf, thereby increasing product yield and reducing processing time and costs.

Implementation Method 1

a laser processing module to cut a work piece. The laser processing module is used to generate a cutting heat source

Methodology Applied
Scientific EffectLaser irradiation: Laser

Implementation Method 2

calculating a thermal stress distribution of non-cracked work piece along the cutting path according to a heating condition

Methodology Applied
Scientific EffectThermal stress: Thermal Expansion

Implementation Method 3

determining an irradiation condition for the auxiliary heat sources to balance the undesired thermal stress of non-cracked work piece

Methodology Applied
Scientific EffectThermal stress balancing: Thermal Expansion

Implementation Method 4

The work piece is then irradiated along the cutting path with auxiliary heat sources so as to eliminate the undesired thermal stress

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8330075B2Control method of optical cutting
Publication Date: 2012.12.11 NAT CHUNG SHAN INST SCI & TECH
  • US8330075B2 patent drawing
  • US8330075B2 patent drawing
  • US8330075B2 patent drawing

AI summary

The invention discloses a control method of optical cutting. A laser processing module is used to generate a cutting heat source and an auxiliary heat source. The control method of optical cutting includes the steps of determining a cutting path on the work piece first; then calculating a thermal stress distribution along the cutting path according to a heating condition; next determining an irradiation condition for the auxiliary cutting heat source according to the thermal stress distribution induced by the cutting heat source; and irradiating the work piece along the cutting path with the cutting heat source and simultaneously irradiating the work piece with the auxiliary cutting heat source. The cutting of the work piece is therefore finished.