LED Light Extraction via Substrate Micro-Structures
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Solution Overview
Problem
Conventional light emitting diodes (LEDs) face challenges in improving light emission efficiency, emission angle, and production yield due to additional treatments that can damage semiconductor layers and increase production costs.
Innovation Solution
A light emitting device with a semiconductor light emitting unit and a light-transmitting substrate featuring rough micro-structures on its side surfaces, where the covering rate of these micro-structures on the first surfaces is greater than on the second surfaces, formed through a cutting process that creates specific strip-shaped regions and intervals, enhancing light extraction efficiency without damaging the semiconductor layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If additional treatment is applied to the substrate to improve light emission efficiency and angle, then optical performance is improved, but the semiconductor layers are damaged and production cost increases
Solution Approach 1:
The patent forms rough micro-structures on the substrate surface before depositing the semiconductor layers. This preliminary action creates the desired light extraction properties in advance, eliminating the need for subsequent treatments that would damage the semiconductor layers. The micro-structures are formed via chemical etching of the substrate before semiconductor deposition, ensuring the semiconductor layers remain intact while achieving improved light emission efficiency.
2Illumination intensity
If additional treatment is applied to the substrate to improve light emission angle, then optical performance is improved, but production cost increases
Solution Approach 1:
The patent combines the substrate processing step with the semiconductor layer deposition process. The rough micro-structures are formed on the substrate surface, and then semiconductor layers are deposited directly onto these micro-structures in the same manufacturing sequence. This merging of processes eliminates the need for separate additional treatment steps, reducing production cost while achieving improved light emission angle.
Solution Approach 2:
The substrate is pre-treated to form rough micro-structures before semiconductor layer deposition. This preliminary formation of micro-structures integrates the optical enhancement function into the substrate preparation stage, avoiding the need for costly post-processing treatments and simplifying the manufacturing workflow.
3Illumination intensity
If additional treatment is applied to the substrate to improve light emission efficiency, then optical performance is improved, but production yield decreases
Solution Approach 1:
The rough micro-structures are formed on the substrate surface before semiconductor layer deposition, allowing the optical enhancement to be built into the structure from the beginning. This eliminates the need for subsequent treatments that would risk damaging the semiconductor layers and reduce production yield. The integrated approach ensures high production yield while maintaining improved light emission efficiency.
Solution Approach 2:
The substrate micro-structure formation and semiconductor layer deposition are combined into a single manufacturing sequence. This merging eliminates the need for separate additional treatment steps that would reduce production yield, as the optical enhancement is achieved during the normal manufacturing process without requiring extra processing steps that could introduce defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in improved light emission efficiency and emission angle while reducing production costs and increasing yield by forming rough micro-structures during the manufacturing process without additional treatments, thus enhancing the overall optical performance of the LED.
Implementation Method 1
The side surface includes two first surfaces, two second surfaces, and rough micro-structures. Each of the first surfaces is connected to one of the two long sides of the upper surface, and each of the second surfaces is connected to one of the two short sides of the upper surface. The rough micro-structures are formed on the first surfaces and the second surfaces
Data Source
AI summary
A light emitting device includes a semiconductor light emitting unit and a light-transmitting substrate. The light-transmitting substrate includes an upper surface having two long sides and two short sides and a side surface, and the semiconductor light emitting unit is disposed on the upper surface. The side surface includes two first surfaces, two second surfaces, and rough micro-structures. Each of the first surfaces is connected to one of the long sides of the upper surface, and each of the second surfaces is connected to one of the short sides of the upper surface. The rough micro-structures are formed on the first surfaces and the second surfaces, a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces. A manufacturing method of the light emitting device is also provided.