Wafer Dividing Equipment With Dual-Camera Verification
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Solution Overview
Problem
Existing methods for dividing wafers, such as two-point and three-point bending, often fail to reliably penetrate cracks along projected dicing lines due to uneven stress distribution, leading to incomplete division of the wafer.
Innovation Solution
A dividing apparatus that includes a holding table with a camera for imaging and a pressing section to apply controlled force along the dicing lines, using cameras to verify division and adjust operations until complete separation is achieved.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two-point bending or three-point bending is used to divide the wafer, then force is applied to divide the wafer at projected dicing lines, but cracks do not extend reliably from division initiating points due to uneven stress distribution
Solution Approach 1:
The pressing section is divided into multiple pressing portions (first pressing portion, second pressing portion, third pressing portion) that can independently apply force to different regions of the wafer. This segmentation allows targeted stress application at specific projected dicing lines, ensuring cracks extend reliably from division initiating points along the intended path.
Solution Approach 2:
Different pressing portions apply different levels and patterns of force to different local regions of the wafer. The pressing section is configured to apply concentrated force at specific locations along the projected dicing lines, creating localized high-stress zones that promote reliable crack extension from division initiating points while avoiding excessive stress in other areas.
2Productivity
If support member is expanded along radial direction to apply force to entire wafer, then force is applied to divide wafer, but wafer is not divided along some projected dicing lines due to uneven force distribution
Solution Approach 1:
Instead of applying force uniformly across the entire wafer, the pressing section is segmented into multiple independent pressing portions that can be selectively activated. This allows the system to maintain high productivity by processing multiple dicing lines simultaneously while ensuring reliable division at each line through targeted local force application.
Solution Approach 2:
The pressing section is configured to dynamically adjust the distribution of force across different pressing portions based on the specific requirements of each projected dicing line. This dynamic force distribution ensures that each dicing line receives adequate force for reliable division while maintaining overall processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable division of wafers at projected dicing lines by verifying and adjusting the division process, minimizing incomplete separation and enhancing the precision of the cutting process.
Implementation Method 1
a first camera that forms a first image to be used for identifying positions of the plurality of projected dicing lines, by imaging the wafer from a side of the first surface
Implementation Method 2
a pressing section configured to divide the wafer at a first projected dicing line that is one of the plurality of projected dicing lines by pressing a portion near the first projected dicing line
Implementation Method 3
applying force to the wafer to cause cracks to extend along a thickness direction of the wafer from the division initiating points
Implementation Method 4
a second camera that forms a second image to be used for determining whether or not the wafer is divided at the first projected dicing line, by imaging the wafer from a side of the second surface
Data Source
AI summary
A dividing apparatus is provided with a second camera that forms a second image to be used for determining whether or not a wafer is divided at a first projected dicing line. That is, in the dividing apparatus, whether or not the wafer is divided at the first projected dicing line can be checked in reference to the second image. Hence, in the dividing apparatus, even in a case where part of the wafer remains at the first projected dicing line and the wafer is not divided, a dividing unit can be operated again to divide the wafer at the first projected dicing line. Consequently, in the dividing apparatus, the wafer can reliably be divided at the first projected dicing line.