SiC Wafer Cutting Alignment for Precise Chip Formation
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Solution Overview
Problem
Existing cutting methods for materials with hexagonal or trigonal crystal structures, such as SiC wafers, often result in chips being cut along planes inclined from the planned cutting plane, leading to undesired shapes.
Innovation Solution
A cutting method that aligns the workpiece with its c-axis inclined to the surface and adjusts the cutting blade's tip portion to minimize the angle with the planned cutting plane, using forces to deform the cutting edge and ensure precise cutting along the desired plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cutting blade is used to cut SiC wafers with inclined c-axis, then cutting can be performed, but the workpiece is cut along a plane inclined from the planned cutting plane
Solution Approach 1:
The cutting blade is pre-adjusted to an inclined state matching the c-axis inclination angle before cutting begins. This preliminary adjustment ensures that when the tip portion cuts into the workpiece, the cutting edge is already positioned to compensate for the crystal structure inclination, enabling accurate cutting along the planned cutting plane without requiring complex real-time adjustments during the cutting process
2Manufacturing precision
If the cutting edge is made still without inclination, then the blade structure is simple, but the tip portion cannot be aligned with the planned cutting plane when c-axis is inclined
Solution Approach 1:
Only the tip portion of the cutting edge is inclined to match the c-axis inclination, while the base end portion remains relatively simple. This localized inclination is achieved by positioning the cutting blade at a specific angle during mounting, creating the necessary alignment precision exactly where the tip portion contacts the workpiece, without requiring the entire blade structure to be complex
3Manufacturing precision
If the base end portion is inclined from the planned cutting plane, then the tip portion can be aligned, but the blade configuration becomes more complex
Solution Approach 1:
The inclination angle of the cutting blade is optimized to be equal to or less than the c-axis inclination angle of the workpiece. By controlling this angular parameter, the tip portion of the cutting edge achieves proper alignment with the planned cutting plane while avoiding excessive blade inclination that would complicate the device structure. This parameter optimization balances alignment precision with structural simplicity
Data Source
AI summary
A cutting method for cutting a workpiece is provided. This cutting method includes holding the workpiece including a crystal structure having a c-axis inclined with respect to a perpendicular to a surface and a c-plane perpendicular to the c-axis and cutting the workpiece along a planned cutting plane that is perpendicular to the surface and is inclined with respect to the c-plane by rotating a cutting blade having an annular cutting edge and making a tip portion of the cutting edge cut into the workpiece. In the cutting the workpiece, the tip portion is made to cut into the workpiece in a state in which a force in such an orientation as to bring an angle formed by the planned cutting plane and the tip portion close to 0° acts on the cutting edge from the workpiece when the tip portion is made to cut into the workpiece.