Wire Mesh Abnormality Detection in Slicing Systems
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Solution Overview
Problem
During the slicing process, wire mesh abnormalities such as wire jumping and merging occur due to high-speed cutting, vibration, and friction, leading to wire disconnection and poor product quality, as the dark and misty slicing chamber makes it difficult to monitor the wire mesh in real time.
Innovation Solution
A processing method and system that monitors the position heights of cutting wires, calculates jumping values, and generates a jumping curve to detect abnormalities, allowing for real-time monitoring and prediction of wire mesh issues, with modules to determine abnormal conditions and trigger corrective actions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If real-time monitoring of wire mesh is implemented, then wire jumping and merging can be detected early, but the complexity of the monitoring system increases
Solution Approach 1:
The patent introduces an intermediary monitoring system comprising cameras, light sources, and image processing units that act as a mediator between the wire mesh and the control system. This intermediary captures images of the wire mesh position and processes them to detect abnormalities, enabling reliable detection without requiring direct complex sensing of the wire mesh itself.
Solution Approach 2:
The patent replaces direct mechanical sensing of wire mesh position with an optical imaging system. Instead of using mechanical sensors that would add complexity, the system uses cameras and image processing to capture and analyze wire mesh position, substituting mechanical detection with optical and computational methods.
2Manufacturing precision
If the slicing chamber is kept dark during operation, then cutting precision is maintained, but visual monitoring of the wire mesh becomes impossible
Solution Approach 1:
The patent introduces lighting units as intermediaries that provide localized illumination for the camera system without significantly affecting the overall dark environment of the slicing chamber. These lighting units enable optical detection of the wire mesh while maintaining conditions suitable for precise cutting.
Solution Approach 2:
The patent creates an optical copy or image representation of the wire mesh position through camera imaging. Instead of directly observing the wire mesh in the dark chamber, the system captures images that replicate the wire mesh position information, allowing analysis and detection without altering the dark slicing environment.
3Productivity
If high-speed cutting is performed, then productivity increases, but wire mesh stability decreases leading to more abnormalities
Solution Approach 1:
The patent implements a feedback control system where the monitoring system continuously detects wire mesh position and abnormalities, and this information is fed back to the control system. The control system can then adjust operating parameters or alert operators to maintain wire mesh stability even during high-speed cutting operations.
Solution Approach 2:
The patent enables preliminary detection of wire mesh abnormalities before they lead to wire disconnection or slicing defects. By continuously monitoring wire mesh position and detecting deviations early, the system can take preventive actions to maintain stability during high-speed operation.
Data Source
AI summary
A processing method for a wire mesh abnormality includes the steps of: obtaining position heights of cutting wires in a wire mesh; obtaining a jumping value of each of the cutting wires based on a vertical difference between each of the position heights of the cutting wires and a position height of a contact surface of the wire mesh and a workpiece; obtaining a jumping curve of the wire mesh based on the obtained jumping values of the cutting wires; and determining whether the wire mesh is abnormal based on the jumping curve of the wire mesh. The states of the wire mesh can be monitored in real time, the occurrence of the abnormality problem of the wire mesh can be predicted in advance, and corresponding processes can be performed in time. A processing system for a wire mesh abnormality and an electronic device are also provided.