Dark LED Encapsulation for High-Contrast Display Panels

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Solution Overview

Problem

Conventional LED packages with transparent encapsulants reflect too much ambient light, leading to lower contrast and difficulty in viewing displayed content, especially in bright conditions.

Innovation Solution

The use of a dark or black encapsulation layer surrounding the LEDs in solid state lighting apparatuses to minimize light reflection and improve contrast.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If transparent encapsulant is used to protect LED chip assembly, then light transmission efficiency is improved, but light reflection from ambient sources increases

Engineering Contradiction:
Improvelight transmission efficiencyVSAvoidlight reflection
Core Design Contradiction:
Use of energy by moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent applies a black or dark-colored coating to the encapsulant material, transforming it from a transparent state that reflects light to a light-absorbing state. This color change enables the encapsulant to maintain its protective function while eliminating the harmful light reflection effect, allowing viewers to see displayed content clearly even in bright ambient conditions.

Inventive Principle:
Principle #32Color changes

2Reliability

If transparent encapsulant is used to protect LED chip assembly, then LED chip protection is improved, but viewing contrast deteriorates

Engineering Contradiction:
ImproveLED chip protectionVSAvoidviewing contrast
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

By changing the encapsulant color from transparent to black/dark, the patent maintains the protective enclosure function while dramatically improving viewing contrast. The dark color absorbs ambient light reflections, allowing the displayed content to stand out clearly, thus resolving the contradiction between protection and visibility.

Inventive Principle:
Principle #32Color changes

3Use of energy by moving object

If transparent encapsulant is used, then light emission efficiency is improved, but ambient light reflection increases

Engineering Contradiction:
Improvelight emission efficiencyVSAvoidambient light reflection
Core Design Contradiction:
Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent transforms the encapsulant from transparent to black/dark colored, enabling it to absorb rather than reflect ambient light. This color modification eliminates the harmful reflection effect while preserving the encapsulant's ability to transmit and protect the LED light emission, thus resolving the contradiction between emission efficiency and reflection control.

Inventive Principle:
Principle #32Color changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dark encapsulation layer reduces light reflection, enhancing contrast and making it easier to view content, even in daylight conditions, while also improving the overall efficiency and brightness of the lighting apparatuses.

Implementation Method 1

a dark or black encapsulation layer surrounding the one or more LEDs

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS12294042B2Light emitting diodes and methods with encapsulation
Publication Date: 2025.05.06 CREELED INC
  • US12294042B2 patent drawing
  • US12294042B2 patent drawing
  • US12294042B2 patent drawing

AI summary

Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.