Data Bus Inversion Encoding for 3D Memory TSV Power Reduction
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Solution Overview
Problem
High power consumption in 3D memory devices, such as High Bandwidth Memory (HBM), due to current charge and discharge at through substrate vias (TSVs) during data transmission between chips.
Innovation Solution
Implementation of a Data Bus Inversion (DBI) system that encodes write data using a DBI algorithm and transmits DBI bits to indicate whether data has been inverted, thereby reducing the number of data bits that transition simultaneously and minimizing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If data transmission is performed through TSVs in 3D memory devices, then bandwidth and memory access speed are improved, but power consumption increases due to current charge and discharge at the TSVs
Solution Approach 1:
The patent applies data bus inversion (DBI) encoding that dynamically changes the data transmission parameters by inverting data bits based on transition counting. This encoding scheme modifies the electrical characteristics of data transmission through TSVs, reducing simultaneous transitions and thereby lowering power consumption while maintaining high-speed access capability
Solution Approach 2:
The patent converts the harmful effect of high power consumption during data transmission into a benefit by using DBI encoding. The encoding process monitors and controls data transitions, transforming the problematic charge-discharge current behavior into an optimized transmission pattern that reduces power consumption while maintaining or improving transmission efficiency
2Speed
If data transmission occurs at high speed through TSVs, then memory performance is improved, but switching noises increase
Solution Approach 1:
The DBI encoding scheme changes the temporal and logical parameters of data transmission by inverting bits based on transition patterns. This parameter modification reduces simultaneous switching activity, thereby decreasing switching noises while preserving high-speed data transmission capability
Solution Approach 2:
The patent transforms the harmful switching noises generated during high-speed transmission into a benefit by using DBI encoding to control and reduce simultaneous transitions. The encoding process converts noisy, chaotic switching patterns into organized, low-noise transmission sequences
Data Source
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AI summary
Apparatuses and methods of data communication between semiconductor chips are described. An example apparatus includes: a first semiconductor chip and a second semiconductor chips that are stacked with each other via through substrate vias (TSVs) provided in one of the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chips communicate with each other by use of data bus inversion data that have been encoded using a DBI algorithm.