Double-Sided Metallized Copper-Ceramic Substrate Production
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Solution Overview
Problem
The existing methods for manufacturing double-sided metallized metal-ceramic or copper-ceramic substrates require complex multi-step processes, particularly with the double DCB bonding process, which increases manufacturing complexity.
Innovation Solution
A method using a carrier with a separating layer to facilitate the bonding of multiple metal and ceramic layers in a single processing step through the DCB process in a protective gas atmosphere, allowing for the formation of double-sided metallized substrates without unintended bonding issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If double DCB bonding process is used to manufacture double-sided metallized substrates, then metallization can be achieved on both sides, but manufacturing process complexity increases
Solution Approach 1:
The patent combines two separate DCB bonding operations into a single bonding step by stacking multiple copper-ceramic assemblies together with spacers and bonding them simultaneously. This merging of operations reduces process complexity while achieving double-sided metallization, directly resolving the technical contradiction.
2Manufacturing precision
If multiple separate bonding steps are used, then each layer can be bonded individually, but production time increases
Solution Approach 1:
Multiple copper-ceramic assemblies are bonded simultaneously in a single DCB bonding step rather than sequentially. This parallel processing approach maintains bonding quality while significantly reducing production time, resolving the contradiction between manufacturing precision and productivity.
Solution Approach 2:
The copper foils are pre-oxidized and assemblies are pre-stacked with spacers before the bonding step. This preliminary preparation enables the subsequent single-step bonding to proceed efficiently without compromising quality, allowing faster production while maintaining precision.
3Ease of manufacture
If metal layers are placed directly on carrier, then bonding can proceed, but unintended bonding between metal and carrier occurs
Solution Approach 1:
A porous separating layer is introduced as an intermediary between the copper foil and the carrier plate. This layer prevents direct contact and unintended bonding between the metal and carrier while still allowing the DCB bonding process to proceed effectively, resolving the contradiction between manufacturing ease and preventing harmful unintended bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient production of double-sided metallized copper-ceramic substrates in a single step, reducing manufacturing complexity and ensuring consistent bonding quality across multiple layers.
Implementation Method 1
The base plate is provided with a separating layer on at least one surface to prevent bonding between the metal or copper contacting and this separating layer and the carrier
Implementation Method 2
bonding of the metal or copper foil to the ceramic layer or plate by means of direct copper bonding (DCB) in a protective gas atmosphere with a low oxygen content and by heating to the bonding temperature
Implementation Method 3
heating to the bonding temperature (for example 1072° C.)
Implementation Method 4
bonding of the metal or copper foil to the ceramic layer or plate by means of direct copper bonding (DCB) in a protective gas atmosphere with a low oxygen content
Data Source
AI summary
A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.