Deep-Drawn Cooling Device With Embossment for Bypass-Flow Control
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Solution Overview
Problem
Existing cooling devices for electrical and electronic assemblies, such as power modules in hybrid and electric vehicles, face inefficiencies in heat dissipation due to bypass flows around turbulators, which reduce the overall cooling efficiency.
Innovation Solution
A cooling device with a deep-drawn bottom plate featuring an embossment in the bending region of the turbulator edge, reducing the radius and enhancing the turbulator's projection into the cooling channel, combined with soldering to minimize bypass flows and increase the turbulator's coverage, thereby improving heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a deep-drawn bottom plate is used to form the cooling channel, then the manufacturing ease is improved, but the bypass flow around the turbulator increases reducing cooling efficiency
Solution Approach 1:
The patent applies local quality by adding an embossment specifically in the bending region of the bottom plate. This localized structural modification creates a protrusion that reduces the radius in the bending region, thereby reducing the bypass flow around the turbulator. The embossment is only placed where needed (in the bending region) rather than modifying the entire bottom plate, maintaining manufacturing ease while improving cooling efficiency locally where the bypass flow occurs.
2Loss of energy
If the turbulator is made larger to block bypass flow, then the cooling efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent solves the problem of blocking bypass flow without increasing turbulator complexity by utilizing another dimension - the embossment in the bottom plate. Instead of making the turbulator larger or more complex in its own plane, the invention creates a three-dimensional structure by adding height to the bottom plate surface. The embossment protrudes into the cooling channel, effectively reducing the bypass flow path in the vertical dimension, thereby blocking bypass flow while keeping the turbulator itself simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks or restricts bypass flows, enhancing the cooling efficiency by ensuring more fluid flows through the turbulator, leading to improved heat dissipation from electrical and electronic assemblies.
Implementation Method 1
a cooling fluid flow of a cooling fluid can flow through the cooling channel
Implementation Method 2
The turbulators generate turbulent flows and increase the cooling surface
Implementation Method 3
The solder can advantageously easily be drawn into the minimized intermediate space between the turbulator and the base plate in the embossment by means of capillary action
Data Source
AI summary
The invention relates to a cooling device for cooling an electrical and/or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component comprising a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40), a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged inside the depression (40) of the cooling channel (5), the turbulator (6) adjoining a bottom surface (44) in the depression (40) of the bottom plate (4) and the bottom surface (44) facing the top plate (3). According to the invention, the bottom plate (4) comprises an embossment (7) in a bending region (43) on the edge of the bottom surface (44).