Deep Molded Reflector Cup for Compact LED Packages
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Solution Overview
Problem
Conventional LED packages are bulky, unreliable, and costly due to multiple components, with shallow reflective cups that block light and require additional lenses for beam shaping, leading to inefficient light emission and increased handling complexity.
Innovation Solution
A deep molded plastic cup with metal pads for LED connection, coated with a reflective film, which eliminates the need for a center hole and additional lenses, allowing for a compact, reliable package that shapes the beam without external lenses by using a lead frame for heat and electrical conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a shallow reflective cup with center hole is used, then the LED die can be mounted and encapsulated, but the package size increases and multiple parts are required
Solution Approach 1:
The patent merges the reflective cup and the mounting structure into a single integrated component. The cup is molded directly over the lead frame, eliminating the need for separate mounting steps and reducing the number of parts. The lead frame serves dual purposes as both electrical connection and mechanical support structure.
Solution Approach 2:
The lead frame is designed to perform multiple functions: providing electrical connections to the LED die, serving as a mechanical support structure, and enabling heat dissipation. This multi-functional design reduces the overall component count and simplifies the package structure.
2Ease of manufacture
If a shallow reflective cup is used, then the manufacturing process is simple, but the beam width becomes wide and cannot be collimated
Solution Approach 1:
The patent changes the key parameter of cup depth from shallow to deep (at least 5 mm). This parameter change enables the cup to effectively collimate the light beam while still being manufacturable using standard molding processes. The increased depth provides the necessary optical path length for beam shaping without complicating the manufacturing process.
3Ease of manufacture
If vertical walls are used in the cup, then the molding process is simple, but light is blocked rather than reflected forward
Solution Approach 1:
The patent replaces vertical walls with curved, angled surfaces that slope inward toward the LED die. These curved surfaces are optimized to reflect light forward while maintaining manufacturability through standard molding processes. The curvature enables effective light redirection without requiring complex post-processing or assembly steps.
4Shape
If external lenses are added for beam shaping, then the beam can be collimated, but the package complexity and cost increase
Solution Approach 1:
The patent merges the beam shaping function into the reflective cup structure itself. The deep, curved geometry of the cup performs the collimation function that would otherwise require a separate lens component. This integration eliminates the need for additional optical elements and reduces overall package complexity.
Solution Approach 2:
The reflective cup is designed to perform multiple functions simultaneously: reflecting light, shaping the beam, and providing structural support. This multi-functional design eliminates the need for dedicated lens components while achieving the desired beam collimation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, reliable, and cost-effective LED package that achieves a narrow, collimated beam without the need for external lenses, enhancing light reflection and reducing package size and handling complexity.
Implementation Method 1
The curved wall of the cup is coated with a highly reflective film, such as silver or aluminum
Implementation Method 2
The lead frame may be copper for good electrical and heat conduction, and the metal pads/electrodes may be plated with gold
Implementation Method 3
The lead frame may be copper for good electrical and heat conduction
Data Source
AI summary
An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of electrodes exposed at the bottom area of the cup for electrically contacting a set of LED die electrodes (18, 20). The lead frame also forms a second set of electrodes outside of the cup for connection to a power supply. A reflective metal (28) is then deposited on the curved walls of the cup. An LED die (16) is mounted at the bottom area of the cup and electrically connected to the first set of electrodes. The cup is then partially filled with an encapsulant (64) containing a phosphor (66).