Deformable Bonding Head for Simultaneous Multi-Chip Attachment
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Solution Overview
Problem
Existing methods for bonding semiconductor chips to flexible substrates are inefficient for simultaneous attachment of multiple chips with different heights, leading to reduced throughput and potential distortion of thermally sensitive substrates.
Innovation Solution
A method and system using anisotropic conductive adhesive (ACA) with a deformable bonding head or expandable elastic membrane to apply heat and pressure simultaneously to multiple semiconductor chips of varying heights, ensuring electrical contact and secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional bonding equipment with metal thermode or hot bar is used to bond semiconductor chips, then a single chip can be bonded, but multiple chips of different heights cannot be bonded simultaneously and throughput is reduced
Solution Approach 1:
The bonding head is made deformable using compliant material that can dynamically adapt its shape to accommodate chips of different heights. The bonding head deforms under the influence of pins applying pressure, allowing simultaneous contact with multiple chips varying in height while maintaining uniform bonding pressure across all chips.
Solution Approach 2:
Gas cylinders or hydraulic mechanisms are used to apply controlled pressure through pins that contact the bonding head. This pneumatic/hydraulic system enables precise pressure distribution across multiple chips of different heights, allowing simultaneous bonding while accommodating height variations through the deformable bonding head material.
2Manufacturing precision
If multiple semiconductor chips are bonded in a dense configuration, then high density attachment is achieved, but subsequent bonding operations can distort the thermally sensitive polymer substrate
Solution Approach 1:
The bonding head is pre-loaded with pins positioned to contact multiple chips before the bonding process begins. This preliminary positioning ensures that pressure is distributed evenly across all chips from the start, preventing localized stress concentrations that could distort the thermally sensitive polymer substrate during subsequent bonding operations.
Solution Approach 2:
The system changes the pressure distribution parameters by using a deformable bonding head that adapts its compliance to match the specific height profile of each chip. This parameter adjustment allows uniform pressure application across chips of varying heights, achieving high-density placement without exceeding the substrate's distortion threshold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-density, simultaneous bonding of semiconductor chips with different heights, improving throughput and preventing substrate distortion, while maintaining electrical contact and mechanical integrity.
Implementation Method 1
electrical contact is made between the semiconductor chips and at least portions of the printed conductive traces
Implementation Method 2
a curing of the thermosetting adhesive of the ACA by applying heat and pressure
Implementation Method 3
the applying of the pressure presses and deforms the conductive spherical elements of the ACA
Implementation Method 4
application of pressure occurs on a second side of each of the multiple semiconductor chips
Data Source
AI summary
The present application provides methods, systems and devices for simultaneously bonding multiple semiconductor chips of different height profiles on a flexible substrate.