Deformable Film Transfer for Micro LED Arrays
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Solution Overview
Problem
Current transfer technologies face challenges in accurately and efficiently transferring micro LED chips of different sizes and materials to a target substrate for full color display applications, as existing methods are not suitable for high-speed, large-scale transfer and can damage the micro LED devices during the process.
Innovation Solution
A transfer method using a deformable film that embeds and integrates objects of various sizes and materials, allowing for selective transfer to a target substrate without the need for bonding and separation processes on a temporary substrate, utilizing processes like Laser-lift-off or Chemical-lift-off for separation and adjusting adhesive forces through embedding depth and deformable film properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing transfer methods (pick-and-place, electrostatic head) are used to transfer micro LED chips, then transfer capability is achieved, but transfer accuracy and device safety deteriorate due to inability to handle small sizes and material differences
Solution Approach 1:
The patent introduces a deformable film as an intermediary carrier between the source substrate and target substrate. The film embeds multiple micro LED chips simultaneously and transfers them as a group, avoiding the inaccuracies and damage risks of individual chip handling by existing methods.
Solution Approach 2:
The patent uses a deformable film that can flex and conform to the shapes of different micro LED chips. This flexible film adapts to various chip geometries and materials, enabling accurate pickup and transfer without rigid contact that could cause damage.
2Productivity
If traditional transfer technologies are used for full color display applications, then individual chip transfer is possible, but productivity deteriorates due to inability to perform high-speed, large-scale transfer
Solution Approach 1:
The patent combines multiple micro LED chips (red, green, blue) onto a single deformable film simultaneously. This merging approach allows batch transfer of many chips in one operation, dramatically increasing productivity compared to individual chip transfer while simplifying the overall manufacturing process.
Solution Approach 2:
The deformable film serves multiple functions: it acts as a pickup tool, a carrier, and a transfer medium simultaneously. This multi-functionality enables the system to handle various chip types and sizes with a single tool, improving both productivity and ease of manufacture.
3Manufacturing precision
If existing methods are used to transfer micro LED chips of different sizes and materials, then transfer capability is achieved, but manufacturing precision deteriorates due to material and size variations
Solution Approach 1:
The deformable film changes its physical parameters (shape, flexibility, surface area) to adapt to different micro LED chip sizes and materials. By adjusting the film's deformation state, the system maintains consistent transfer accuracy across various chip types without requiring different tools for each material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables quick, accurate, and damage-free transfer of micro LED arrays and other semiconductor devices to a target substrate, reducing process costs and time, and is applicable to various fields, particularly contributing to the commercialization of micro LED displays.
Implementation Method 1
decrease adhesive force between the source substrate and the device by a process such as wet etching, and perform pick-and-place by using an elastomer stamp and a difference in adhesive forces
Implementation Method 2
perform pick-and-place on the LED chip by using electrostatic force that is generated by applying a voltage to a silicon head on which an electrode is formed
Data Source
AI summary
A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.