Decorative Surface Effects TRIZ Cases

A film structure combines a texture layer and ribbon unit to enhance mechanical strength and appearance of electronic device shells.

A two-step processing method adjusts ion beam etching conditions based on initial surface measurements to achieve high flatness and smoothness.

Laser pre-cutting reduces substrate thickness before mechanical sawing, preventing chipping and enabling higher cutting speeds.

A MEMS transducer package integrates an acoustic channel within the semiconductor die to transmit signals efficiently.

Cyclic reaction and depressurization remove silicon films, resolving the trade-off between etching speed and controllability.

Dual-frequency capacitively coupled plasma etching reduces line edge roughness and improves resist selectivity for sub-30 nm EUV patterning.

A printing substrate uses dry etching to form minute patterns with high resolution.

Isotropic etching forms recesses to prevent adhesive bonding during mechanical shocks.

Digital erosion and deposition create complex relief structures on ceramic tiles, eliminating preformed negative wear and enabling unlimited design variability.

A heat transfer label features a modifiable area where ink is selectively removed to reveal substrate underneath.

An integrated base pad connects the stylus to the cantilever, resolving thermal drift and resolution limits caused by metal coatings in liquid imaging.

A wafer processing method applies low-k dielectric material between through-wafer interconnects to enhance insulation and suppress metal diffusion.

Heat cross-linked colloidal silica in the protective layer prevents burr generation and cracking on curved surfaces.

A deformable film embeds semiconductor objects to enable precise transfer operations.

A pattern formation method deposits etching products on slimmed resist patterns to create pinning portions for block copolymer self-assembly.

Basic gas pre-treatment converts oxidized silicon nitride surfaces, enabling uniform halogen etching and reducing physical damage.

Applying a basic-substance-free top coat protects guide patterns from damage during Si-block copolymer phase separation.

Conductive bonding material joins semiconductor substrates through vertical protrusions, eliminating external wires and reducing device thickness.

Heat-sensitive adhesive layers enable component integration in wafer cavities while minimizing curvature from thermal expansion mismatches.

Fusible balls protrude from blind holes to enable controlled crushing during thermo-compression assembly.

Liquid glue cures under pressure to bond decorative layers directly onto fiber cores, eliminating separate resin intermediate steps.

An embedded surrounding wall extends the etchant path to prevent thin guard ring collapse and widen the release etching time margin.

Thermal laser irradiation deforms scale-shaped aluminum powder into spheres to print designs without exposing particles, preserving chemical resistance.

A nanochanneled device with integrated platinum electrodes modulates drug release through electrophoresis at low voltage.

Ion implantation precedes annealing to dope rough polysilicon, preserving surface finish while maintaining high doping levels.

Staged trench etching and annealing remove fluorine impurities to prevent electrical degradation in high-density memory devices.

Segmented liner and cover layers with distinct etching rates resolve residue formation during sacrificial layer removal, ensuring clean cavity formation.

Reinforcing the glass substrate before cutting eliminates fine cracks at cut cross sections, improving breaking strength and simplifying mass production.

Laser-assisted chemical vapor deposition deposits materials on both sides of a freestanding film suspended over a substrate cavity.

Plasma etching creates non-vertical sidewall surfaces by removing walls between adjacent openings, resolving precision and complexity trade-offs.

A mask manufacturing method forms initial ribs and removes upper edge portions to achieve precise final rib dimensions.

A metal core substrate uses patterned etching to form conductive channels and insulating layers.

Moderated etching with ammonium persulfate and an azole compound prevents damage to pre-patterned layers while maintaining reliable signal conductivity.

Pre-cutting grains on a film layer allow users to remove waste patterns easily while maintaining thermal bond strength.

Pre-cleaning crystalline silicon substrates removes contaminants before texturization to ensure uniform surface morphology.

A decorated part uses infrared laser processing to create fine grooves in a dark surface coat-layer.

Negative pressure stretches a viscous composition into microstructures, eliminating separation loss and preserving sensitive ingredients.

Segmenting the sheet into distinct functional layers resolves the trade-off between aesthetic detail and mechanical strength during hot pressing.

Segmenting the resist into an organic layer and a chemically amplified negative resist layer prevents pattern collapse while maintaining etching resistance.

A via structure uses trench isolation and overlapping layer portions to connect conductive paths.

A chemical planarization method uses a surface layer to selectively dissolve convex portions of semiconductor films.

Platelet pigments and solid lubricants in a specific ratio enhance adhesion and scratch resistance while maintaining impermeability against thermal stresses.

Thermal oxidation defines MEMS vertical dimensions through controlled oxide layer growth and selective etching.

An adhesion promotion layer bonds the vinyl decal to the floor finish, preventing delamination while maintaining consistent coefficient of friction.

Teeth on a suspended bump reduce stiction and mechanical stress, preventing adhesion and collision damage in compact microelectromechanical systems.

A MEMS diaphragm uses net compressive stress to reduce manufacturing costs while a support post limits deflection.

Suspended aluminum salts in a caustic soda bath regulate corrosive action, balancing removal speed and surface finish quality.

A MEMS resonator uses a silicon oxide isolation joint to electrically insulate the vibrating structure from the substrate.