Via Structure With Trench Isolation And Overlap

The patent extracts the insulating function from the trench filling process. Instead of filling trenches with insulating material, the invention uses the natural insulating property of the substrate material itself and creates isolation through precise trench positioning and metallization layer design, eliminating the need for separate insulating fill material and simplifying manufacturing

The patent introduces an intermediary approach where the trench structures serve dual purposes: they provide mechanical support and define via boundaries while the metallization layers provide both electrical conduction and insulation functions. This intermediary design eliminates the need for separate insulating material filling

The patent employs composite material principles by combining different metallization layers (first and second metallization layers) with the substrate material and trench structures. This composite construction provides both the simplified direct connection through insulation layer openings and enhanced mechanical strength through the overlapping via portions and surrounding layer portions that create a reinforced structure

The patent solves the mechanical strength issue by transitioning from a simple vertical via structure to a multi-dimensional structure where via portions extend in multiple directions and overlap with surrounding layer portions. This dimensional expansion creates a three-dimensional reinforced structure that maintains strength while allowing direct connections