Metal Core Substrate with Patterned Etching for Thermal Dissipation
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Solution Overview
Problem
Conventional chip packaging technologies, such as the Quad Flat No-lead (QFN) type package, face challenges in thermal dissipation and light emission due to their design, which limits their application in high thermal chip packaging and LED chips, where efficient heat transfer and open structures are required.
Innovation Solution
A high thermal conducting circuit substrate is developed using a metal core substrate etched at different speeds to form patterned layers, with insulating and conductive layers, and through holes to enhance thermal conductivity and allow for light emission, featuring a laminating structure with exposed bonding pads and conductive channels for efficient heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If QFN type package is used for thermal dissipation, then thermal conductivity is improved, but light emission capability deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional regions: a closed bottom portion for thermal dissipation and a top opening for light emission. This segmentation allows the same package to simultaneously satisfy both thermal management requirements and light output requirements without compromise.
2Reliability
If QFN type package is used for chip mounting, then electrical connectivity is improved, but structural adaptability deteriorates
Solution Approach 1:
The package structure is designed to perform multiple functions: it provides electrical connectivity through bonding pads, thermal dissipation through the metal core substrate, and light emission through the top opening. This multi-functionality makes the package adaptable to different chip types including LED chips, power devices, and hybrid applications.
3Ease of manufacture
If conventional etching is used on metal core substrate, then manufacturing simplicity is maintained, but manufacturing precision deteriorates
Solution Approach 1:
The etching mask is designed with different mesh densities in different regions, creating local variations in etching speed. This allows different areas of the metal core substrate to be etched at different rates, enabling precise control of etching depth and formation of complex three-dimensional structures while maintaining a relatively simple manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal conductivity and light emission capabilities, enabling the substrate to effectively manage heat from high power electronic elements and LED chips, while maintaining electrical connectivity, thus addressing the limitations of conventional packaging technologies.
Implementation Method 1
etching the metal core substrate at a plurality of different etching speeds
Implementation Method 2
high thermal conducting circuit substrate which provides higher thermal conducting efficiency to high power electronic elements disposed thereon
Data Source
AI summary
A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.