Semiconductor Substrate Bonding via Conductive Protrusions
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Solution Overview
Problem
The existing electronic devices with MEMS and semiconductor elements connected by bonding wires face increased thickness due to larger bonding spaces and require additional fabrication processes, including electrode pad formation on the back surface of the semiconductor element.
Innovation Solution
The electronic device employs a first semiconductor substrate with a bonding projection section and a second substrate bonded via conductive bonding material through a through hole, eliminating the need for external bonding wires and reducing fabrication processes by using a conductive bonding material for both electrical and physical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to connect the semiconductor element to the MEMS element, then electrical connection is achieved, but the bonding space increases leading to increased device thickness
Solution Approach 1:
The patent combines the bonding wire function with the bonding pad structure by forming conductive protrusions that extend from the bonding pad through the insulation film. This integration eliminates the need for separate bonding wires, reducing the bonding space and device thickness while maintaining electrical connection reliability
Solution Approach 2:
The invention transitions from a planar bonding approach to a three-dimensional structure by forming conductive protrusions that extend vertically through the insulation film. This dimensional change allows electrical connection to be achieved within the vertical space rather than requiring horizontal bonding wire extension, thereby reducing device thickness
2Reliability
If bonding wires are connected from the back surface of the semiconductor element, then electrical connection is established, but additional fabrication processes including electrode pad formation are required
Solution Approach 1:
The patent merges the electrode pad and bonding wire functions into a single integrated structure. The conductive protrusion serves both as the electrical connection point (replacing the bonding wire) and as an extension of the bonding pad structure, thereby eliminating the need for separate electrode pad formation processes on the back surface
Solution Approach 2:
The conductive protrusion structure performs multiple functions: it serves as the bonding pad extension, provides the electrical connection pathway, and acts as the bonding interface. This multi-functionality reduces the number of fabrication processes required while ensuring reliable electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner device with reduced packaging space and simplified fabrication, as the conductive bonding material connects the substrates electrically and physically, eliminating the need for external bonding wires and electrode pad formation.
Implementation Method 1
a second semiconductor substrate that is bonded by welding to the bonding projection section of the first semiconductor substrate via conductive bonding material
Data Source
AI summary
An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.