Wafer Cavity Component Integration via Thermal Adhesive

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Solution Overview

Problem

Current methods for integrating discrete components into a wafer face challenges such as curvature and fragility due to thermal expansion coefficient differences between the coating resin and silicon components, as well as difficulties in precise bonding and separation, limiting the industrialization and reliability of the process.

Innovation Solution

A method utilizing a host wafer with cavities and a two-sided heat-sensitive adhesive layer, where the adhesive loses its adhesive properties when heated, allowing for the integration of discrete components with a thermal expansion coefficient matching that of the components, and a coating material that minimizes shrinkage, ensuring precise adhesion and easy separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If components are integrated using coating resin and adhesive, then integration is achieved, but curvature and fragility occur due to thermal expansion coefficient differences

Engineering Contradiction:

Improveintegration reliabilityVSAvoidwafer flatness

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent changes the material parameter (thermal expansion coefficient) by selecting an adhesive with a coefficient matching that of silicon components. This parameter matching eliminates the curvature problem caused by differential thermal expansion during temperature variations, while maintaining reliable integration of components.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies homogeneity by using an adhesive material that is homogeneous in its thermal expansion properties with the silicon components. This material homogeneity ensures uniform behavior across the wafer during thermal cycles, preventing localized curvature and improving overall wafer flatness.

Inventive Principle:

Principle #33Homogeneity

2Strength

If permanent adhesive is used for bonding components to support, then strong bonding is achieved, but separation becomes difficult

Engineering Contradiction:

Improvebonding strengthVSAvoidseparation ease

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent applies dynamics by using a thermally reversible adhesive that transitions from a bonded state at low temperature to a separated state at high temperature. This dynamic behavior allows the adhesive to provide strong bonding during integration while enabling easy separation during component removal, solving both requirements.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent utilizes phase transitions of the thermally reversible adhesive, which changes its adhesive properties through temperature-induced phase changes. At processing temperatures, the adhesive transitions to a non-adhesive phase allowing separation, while at lower temperatures it maintains strong bonding for component integration.

Inventive Principle:

Principle #36Phase transitions

3Productivity

If high-density integration is implemented, then component density increases, but curvature effects are amplified

Engineering Contradiction:

Improveintegration densityVSAvoidwafer flatness

Core Design Contradiction:

ProductivityVSShape

Solution Approach 1:

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces curvature and fragility issues, enabling reliable and efficient integration of components with improved handling and processing capabilities, allowing for high-density integration and further processing in microelectronic lines.

Implementation Method 1

a two-sided heat-sensitive adhesive layer 22, in which the adhesive layer 22 loses its adhesive properties when it is heated

Methodology Applied

Scientific EffectHeat-sensitive adhesive property loss: Thermal Expansion

Data Source

PatentEP2162907B1Device including components embedded in cavities of a receptor plate and corresponding method

Publication Date: 2022.01.05 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Figure 1A~2
Figure 3~4B
Figure 4C~4E

AI summary

The invention relates to an electronic device including discrete integrated components and comprising: a so-called reception plate (2) including cavities (5, 5') containing said components having an active face (10) located in the same plane as a face (8) of the reception plate; and a side coating material (6) for the components in the cavities.