Deformation Preventing Layer for Substrate Thermal Stress
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Solution Overview
Problem
Thin glass substrates used in mobile and flexible display devices are fragile and prone to deformation due to thermal stress and deposition stress, while metal substrates with high thermal resistance can also deform due to differences in thermal expansion coefficients between the substrate and deposited layers.
Innovation Solution
A substrate with a thin film transistor on one surface and a deformation preventing layer on the other surface, comprising layers of the same material and thickness as the planarization, buffer, or protective layers, to mitigate thermal stress and prevent substrate deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a thin glass substrate is used to make the display device thin and light, then the device can be made thinner and lighter, but the substrate becomes fragile and weak in withstanding external impact
Solution Approach 1:
The patent uses a composite structure consisting of a glass substrate combined with a buffer layer and a deformation preventing layer. This composite material approach allows the substrate to maintain thinness and light weight while the additional layers provide enhanced mechanical strength and impact resistance that a single thin glass layer cannot achieve alone.
2Strength
If a plastic substrate is used to replace glass substrate for flexibility and impact resistance, then the substrate becomes more flexible and resistant to external impact, but the substrate cannot bear high-temperature processes
Solution Approach 1:
The patent employs a composite structure with a glass substrate (providing thermal resistance) combined with a buffer layer and deformation preventing layer (providing impact resistance and flexibility). This composite approach allows the substrate to simultaneously achieve high-temperature process compatibility and mechanical durability that plastic substrates alone cannot provide.
3Temperature
If a metal substrate is used to achieve high thermal resistance and flexibility, then the substrate can bear high-temperature processes and is flexible, but the substrate deforms due to difference in thermal expansion coefficients between substrate and deposited layers
Solution Approach 1:
The patent introduces a deformation preventing layer specifically designed to counteract thermal expansion differences. By carefully selecting the material properties and thickness of this layer, the system compensates for the thermal expansion coefficient mismatch between the metal substrate and deposited layers, preventing deformation during high-temperature processes while maintaining the substrate's thermal resistance and flexibility.
Solution Approach 2:
The deformation preventing layer acts as a counterbalancing element that offsets the deformation caused by thermal expansion differences. This layer provides an opposing stress that counteracts the warping tendency, effectively neutralizing the shape change that would otherwise occur during thermal processing.
4Manufacturing precision
If layers are deposited on a substrate and high-temperature processes are applied, then the desired thin film structures are formed, but the substrate becomes deformed due to thermal stress
Solution Approach 1:
The deformation preventing layer serves as a counterbalancing element that offsets the thermal stress-induced deformation. By positioning this layer on the opposite side of the substrate from the deposited layers, it creates an opposing moment that counteracts the warping force, allowing high-temperature processes to proceed without substrate curvature.
Solution Approach 2:
The patent modifies the substrate structure by adding a deformation preventing layer with specific material properties and thickness. This structural parameter change enables the substrate to withstand thermal stress during thin film deposition and high-temperature processes without deforming, maintaining both manufacturing precision and substrate flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The deformation preventing layer effectively offsets thermal stress, preventing substrate curvature and detachment between layers during high-temperature processes, ensuring the substrate remains flat and functional.
Implementation Method 1
the resultant metal substrate is deformed due to a difference between thermal expansion coefficients of the substrate and the layer
Data Source
AI summary
A substrate prevented from being deformed due to thermal stress or deposition stress includes a deformation preventing layer arranged on one surface of the substrate. The substrate can include a thin film transistor arranged on one surface of the substrate and the deformation preventing layer, arranged on the another surface of the substrate, and including at least one layer.