Deposition Apparatus Barrier Member for Quantum Dot Purity
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Solution Overview
Problem
Current methods for forming quantum dot layers, such as printing and coating, face challenges in achieving high purity and are costly, requiring additional equipment and struggling to efficiently deposit multiple materials.
Innovation Solution
A deposition apparatus and method using thermal evaporation, with a vacuum chamber, nozzles, and heating devices, allows for the precise deposition of at least two kinds of materials, including organic and inorganic materials, to form high purity quantum dot layers by controlling the size and thickness of deposited materials, preventing mixing through a barrier member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printing methods or coating methods are used to form quantum dot layers, then the manufacturing process can be simplified, but the purity of the deposited layer decreases and manufacturing cost increases
Solution Approach 1:
The patent changes the physical state and deposition parameters by using thermal evaporation in a vacuum environment, transforming the deposition process from liquid-based (printing/coating) to vapor-based. This parameter change enables high purity deposition while maintaining process simplicity through automated vacuum deposition control
Solution Approach 2:
The patent employs a vacuum chamber to create an inert environment during thermal evaporation, preventing contamination and oxidation of the deposited quantum dot layer. This inert environment ensures high layer purity while the vacuum system integrates seamlessly into existing manufacturing equipment
2Device complexity
If printing methods or coating methods are used to form quantum dot layers, then equipment requirements are reduced, but manufacturing cost increases due to additional equipment needs
Solution Approach 1:
The patent makes existing vacuum deposition equipment multi-functional by configuring it to deposit multiple different materials (organic and inorganic) for quantum dot layer formation. This eliminates the need for separate specialized equipment for different deposition tasks, reducing overall equipment requirements while maintaining cost-effectiveness
3Adaptability or versatility
If multiple materials are deposited using printing or coating methods, then the process becomes more complex, but achieving high purity becomes more difficult
Solution Approach 1:
The patent segments the deposition process into distinct sequential steps within the vacuum chamber, with separate deposition zones for different materials. Barrier members are used to physically separate deposition regions, preventing material mixing and maintaining high purity even when depositing multiple materials
Solution Approach 2:
The patent introduces barrier members as intermediary elements between different deposition zones. These barriers prevent direct contact and mixing of evaporated materials from different sources, ensuring that each material layer maintains its purity while enabling multi-material deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of high purity quantum dot layers inexpensively using existing facilities, with controlled quantum dot size and emission wavelength, achieving efficient and cost-effective multi-layer deposition.
Implementation Method 1
a heating device configured to heat the deposition source
Implementation Method 2
a vacuum chamber configured to surround the substrate, the nozzle, the deposition source and the barrier member
Data Source
AI summary
A deposition apparatus includes a first nozzle configured to spray a first deposition material toward a substrate and a second nozzle configured to spray a second deposition material, a first deposition source configured to supply the first deposition material to the first nozzle and a second deposition source configured to supply the second deposition material to the second nozzle. The deposition apparatus further includes a barrier member disposed between the first nozzle and the second nozzle and is configured to block the first deposition material evaporated through the first nozzle from being mixed with the second deposition material evaporated through the second nozzle and a vacuum chamber configured to surround the first and second nozzles, the first and second deposition sources and the barrier member.