Deposition Mask Packaging Structure for Deformation Control
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Solution Overview
Problem
Deposition masks used in organic EL display devices are prone to plastic deformation during transportation due to applied forces and temperature changes, leading to instability in deposition material adherence and reduced light emission efficiency.
Innovation Solution
A deposition mask package with a receiving portion and lid portion that includes a flexible film and interposed sheets with a thermal expansion coefficient difference of 7 ppm/°C or less, preventing deformation by absorbing forces and maintaining dimensional stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If deposition masks are stacked during transportation to improve efficiency, then transportation productivity is improved, but the masks are prone to plastic deformation due to applied forces and thermal expansion differences
Solution Approach 1:
A buffer sheet is inserted between stacked deposition masks to prevent direct contact and reduce applied forces. The buffer sheet acts as an intermediary layer that absorbs mechanical stress and prevents plastic deformation of the mask surfaces during transportation and stacking operations.
Solution Approach 2:
The patent specifies that the buffer sheet should have a thermal expansion coefficient similar to that of the deposition mask. This matching of thermal expansion properties prevents differential expansion and contraction during temperature changes, avoiding warping and deformation of the masks when stacked in varying thermal environments.
2Strength
If rigid packaging materials are used to protect deposition masks, then mechanical strength is improved, but the masks are still susceptible to deformation from impact forces and thermal stress
Solution Approach 1:
The buffer sheet is placed beforehand between deposition masks in the packaging structure to provide cushioning protection. This pre-positioned protective layer absorbs and distributes impact forces before they can reach the mask surfaces, preventing deformation while maintaining packaging integrity.
Solution Approach 2:
The patent changes the material parameters of the buffer sheet, specifically selecting a material with appropriate thermal expansion coefficient matching the deposition mask and suitable mechanical properties for cushioning. This parameter optimization allows the packaging to protect against both mechanical impact and thermal stress simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents plastic deformation of the deposition mask during transportation, ensuring stable deposition material adherence and maintaining light emission efficiency by using flexible films and interposed sheets with matching thermal expansion coefficients.
Implementation Method 1
a concave portion provided on an inner surface of the receiving portion in correspondence with the effective region, the concave portion being covered with a flexible film
Implementation Method 2
interposed sheets with a thermal expansion coefficient difference of 7 ppm/°C or less
Data Source
AI summary
A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.