Deposition Mask Metal Plate Etch Structure for Uniform Fine Through-Holes
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Solution Overview
Problem
Existing deposition masks for OLED panels face challenges in forming uniform, fine-sized through-holes, leading to deteriorated deposition uniformity and efficiency, particularly for high-definition and ultra-high-definition displays, where adjacent holes often connect, causing deposition failures.
Innovation Solution
A metal plate deposition mask is designed with a base metal plate and surface layers having different elemental compositions or etch rates, featuring a manufacturing method that includes forming photoresist layers and etching to create through-holes with a calculated etching factor of 2.5 or more, ensuring uniformity and preventing photoresist layer de-filming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fine metal mask is used to form UHD patterns, then the definition and resolution of the display device is improved, but the through-holes become difficult to form uniformly and adjacent holes may connect
Solution Approach 1:
The patent changes the physical and chemical parameters of the metal plate by forming surface layers with different compositions (containing elements such as Cr, Ti, Mn, Mo, Ag, Zn, Al, or their oxides) and different thicknesses (1-1000 nm) on opposite surfaces. This creates different etch rates on each surface, allowing precise control of through-hole formation parameters to achieve uniform holes without connection while maintaining high deposition reliability
Solution Approach 2:
The patent creates a composite structure consisting of a base metal plate (such as Invar alloy) with surface layers having different compositions. The surface layers contain etch-resistant elements that form a protective barrier during etching, while the base material provides the necessary mechanical properties. This composite structure enables precise control of etching behavior to form uniform through-holes for UHD patterns
2Productivity
If the etch rate is increased to improve manufacturing efficiency, then the productivity is improved, but the uniformity of through-holes deteriorates
Solution Approach 1:
The patent introduces a controlled etch rate differential between opposite surfaces by forming surface layers with specific compositions and thicknesses. This allows the etching process to proceed at optimized speeds while maintaining uniform through-hole formation, resolving the trade-off between manufacturing efficiency and precision
Solution Approach 2:
The surface layers act as intermediary protective barriers during the etching process. These layers with different etch rates mediate the interaction between the etchant and the base metal plate, enabling controlled material removal that maintains both speed and uniformity in through-hole formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the uniformity and efficiency of pattern deposition, enhancing the manufacturing yield and process efficiency of OLED panels by forming consistent, fine through-holes that prevent adjacent hole connections and maintain high-definition display quality.
Implementation Method 1
an etch rate of the base metal plate is greater than those of the first surface layer and the second surface layer
Data Source
AI summary
A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.