Vacuum Evaporation Coating TRIZ Cases
- Inert-Coated Vaporization Trays for Low-Impurity Reagent Delivery
Chemically compatible tray materials and inert coatings cut metal contamination during solid reagent vaporization for cleaner semiconductor gas delivery.
- Rotating Arc Target Positioning for Shave-Free Film Deposition
By rotating the target to shift arc contact points, this case avoids shaving, improves target use, and maintains deposition quality.
- Tilted Mask Assembly for Precise Display Pattern Deposition
A tilted mask assembly and nozzle reduce mask deformation during deposition, improving pixel placement and display image clarity.
- Tilted Mask Assembly Support for Accurate Display Layer Deposition
A 3°-14° tilted mask with segmented support and a matched nozzle layout reduces sagging, improving pixel accuracy and deposition uniformity.
- CoPt-Oxide Hard Bias Film for Room-Temperature Magnetic Coercivity
A CoPt-oxide hard bias film uses tuned Co, Pt, oxide content and thickness to reach high coercivity and remanence without high-temperature deposition.
- Yttrium Monoxide Film Deposition via DC Magnetron Sputtering
Reactive DC magnetron sputtering controls oxygen partial pressure to form semiconducting yttrium monoxide films without pulsed laser deposition.
- Fine Metal Mask Structure for Uniform OLED Evaporation Stress
Intersecting mask strips and zoned through-hole arrays balance FMM precision with stress uniformity, reducing deformation in OLED evaporation.
- Deposition Mask Metal Plate Etch Structure for Uniform Fine Through-Holes
Different etch-rate surface layers help deposition masks form uniform fine through-holes without hole connection, improving OLED pattern yield.
- Transfer Robot Temperature Preconditioning for Wafer Chamber Handoffs
Preheating or cooling the transfer robot during the current wafer process removes chamber-to-chamber delay and helps preserve film properties.
- Nb-Doped Piezoelectric Film Orientation for High-Temperature Leak Control
Controlling Nb content and crystal orientation in a perovskite piezoelectric film suppresses high-temperature leak current and defects.
- Lithium Coating Deposition with Molten Target Agitation
Molten lithium agitation disperses passivation, enabling lower-vacuum coating deposition with less arcing and higher deposition rates.
- Bottom-Up Tungsten Gapfill for Narrow Semiconductor Features
Bottom-up tungsten gapfill uses MoCl5 and H2 to fill narrow features while minimizing top-surface deposition and post-etch steps.
- Grain-Oriented Steel Sheet Coating for Annealing Adhesion and Iron Loss
A dual coating stack preserves adhesion after strain relieving annealing while maintaining tensile stress and low iron loss in grain-oriented steel sheet.
- Overlap Susceptor and Preheat Ring for Purge Gas Exhaust Control
Separate exhaust paths, a vented liner, and an overlapping susceptor-preheat ring prevent gas dilution and improve deposition uniformity.
- PZT Film Structure With Oriented Buffer Layers for Better Crystallinity
A (100)-oriented zirconium oxide and platinum stack improves PZT crystallinity, ferroelectric behavior, and sensor detection sensitivity.
- Deposition Mask Metal Plate for Uniform Fine Through-Hole Etching
A dual-etch-rate metal plate helps deposition masks form uniform fine through-holes, reducing hole bridging and improving OLED patterning yield.
- Vacuum Wafer Handling Layout for Compact High-Throughput Processing
Overlapping load-lock and transfer regions shorten wafer movement, reduce installation area, and support simultaneous vacuum processing.
- Amorphized Substrate Surfaces for Low-Temperature Oxide-Free Bonding
Low-energy particle bombardment amorphizes and purifies substrate surfaces, enabling strong low-temperature bonding without oxide inclusion.
- Process Chamber Guide Sealing for Low-Particle Substrate Transport
A sealed guide with roller bearings and a close sealing surface limits particle entry and gas leakage while keeping substrate carriers moving smoothly.
- Vacuum Sputtering of Doped Silicon for Edge-Shaded Solar Cells
PVD sputtering with edge shading forms doped silicon passivated contacts while avoiding toxic CVD gases, edge wrap, and extra etching.