Transfer Robot Temperature Preconditioning for Wafer Chamber Handoffs

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In multi-chamber semiconductor processing systems, the temperature differences between chambers cause delays in wafer transfer, leading to productivity losses and potential film property degradation due to premature processing before the wafer reaches the target temperature.

Innovation Solution

A temperature adjustment unit is integrated into the transfer robot, which begins to adjust the robot's temperature based on the target temperature of the next chamber during the current process, ensuring the wafer reaches the correct temperature by the time it is transferred, thus eliminating delay times and maintaining optimal film properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wafer transfer is performed between chambers with different target temperatures, then the wafer can be processed in multiple chambers, but delay time occurs while the wafer temperature adjusts to the target temperature

Engineering Contradiction:

Improvewafer transfer efficiencyVSAvoidtemperature adjustment delay

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The transfer robot temperature is adjusted in advance before the wafer transfer is completed. The temperature adjustment unit starts heating or cooling the transfer robot while the wafer is still being processed in the current chamber, so that by the time the wafer arrives at the next chamber, the transfer robot has already reached the target temperature, eliminating the delay time.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The transfer robot acts as an intermediary between chambers with different temperatures. By equipping the transfer robot with a temperature adjustment unit, it can actively control its own temperature to match the target chamber temperature, serving as a thermal bridge that facilitates smooth wafer transfer without temperature-related delays.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If wafer transfer delay is eliminated through temperature adjustment, then productivity increases, but the device complexity increases due to additional temperature adjustment unit

Engineering Contradiction:

Improvewafer transfer efficiencyVSAvoidtransfer robot structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The transfer robot is designed with multi-functionality by integrating both wafer transfer capability and temperature adjustment capability into a single device. The temperature adjustment unit is incorporated into the existing transfer robot structure, allowing it to perform both mechanical transfer and thermal control functions, thereby reducing the need for separate dedicated temperature control systems.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If temperature control is maintained during transfer, then film properties are preserved, but energy consumption increases due to continuous temperature adjustment

Engineering Contradiction:

Improvefilm property controlVSAvoidtransfer robot energy consumption

Core Design Contradiction:

Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The temperature adjustment unit operates with feedback control based on the target temperature of the destination chamber. The system monitors the current transfer robot temperature and adjusts it dynamically to reach and maintain the target temperature, avoiding unnecessary energy consumption by stopping heating or cooling once the target temperature is achieved.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces or eliminates delay times due to temperature differences between chambers, enhancing productivity and ensuring the film formed has the desired properties by maintaining precise temperature control during wafer transfer.

Implementation Method 1

the temperature adjustment unit mounted on the transfer robot adjusts the transfer robot temperature

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230335423A1Multi-chamber semiconductor processing system with transfer robot temperature adjustment

Publication Date: 2023.10.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A multi-chamber semiconductor processing system is provided. The multi-chamber semiconductor processing system includes: a plurality of chambers, each of the plurality of chambers corresponding to a semiconductor process; a transfer chamber; a transfer robot in the transfer chamber and having a holding member capable of holding a wafer, the transfer robot configured to transfer the wafer among the plurality of chambers; a first temperature sensor mounted on the holding member and configured to detect a transfer robot temperature; and a temperature adjustment unit mounted on the transfer robot and configured to adjust the transfer robot temperature.