Detachable TPG Thermal Leveler for Corrosion and Reuse
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Solution Overview
Problem
Thermal pyrolytic graphite (TPG) based thermal levelers in semiconductor processing are prone to corrosion and wear in corrosive environments, leading to reduced performance and high replacement costs due to the expensive manufacturing process and batch processes involved.
Innovation Solution
A detachable thermal leveler system using TPG, where the leveler is releasably associated with a cover plate and base plate via various fastening mechanisms, allowing for easy removal and reuse when performance deteriorates, and can be transferred to another apparatus, reducing economic and operational burdens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal leveler is made from TPG material with high thermal conductivity, then thermal performance is improved, but manufacturing cost increases due to expensive batch processes
Solution Approach 1:
The thermal leveler is divided into a TPG layer and a separate encapsulating layer made from different materials. This segmentation allows each layer to be manufactured using appropriate processes - TPG using CVD for thermal performance, and encapsulating layer using more cost-effective methods, thereby reducing overall manufacturing cost while maintaining thermal performance.
Solution Approach 2:
The invention uses composite structure combining TPG material with encapsulating materials (metals, ceramics, or alloys). This composite approach leverages the high thermal conductivity of TPG while using the encapsulating layer to provide mechanical strength and corrosion resistance, achieving optimal thermal performance at reduced manufacturing cost compared to pure TPG components.
2Temperature
If thermal leveler is used in corrosive semiconductor processing environment, then thermal management is improved, but leveler durability deteriorates due to corrosion and wear
Solution Approach 1:
An encapsulating layer is introduced as an intermediary between the TPG thermal leveler and the corrosive processing environment. This encapsulating layer (made from metal, ceramic, or alloy materials) acts as a protective barrier that shields the TPG material from corrosion and wear, thereby extending the leveler's service life while maintaining its thermal management function in corrosive semiconductor processing environments.
Solution Approach 2:
The composite structure of TPG core with encapsulating shell provides both thermal management capability and corrosion resistance. The encapsulating layer materials (such as aluminum, copper, stainless steel, aluminum nitride, or aluminum oxide) are specifically selected for their resistance to corrosive chemistries, allowing the thermal leveler to withstand harsh processing environments and extend operational duration.
3Reliability
If thermal leveler is replaced when performance deteriorates, then system reliability is maintained, but economic cost increases due to expensive manufacturing and batch processes
Solution Approach 1:
The encapsulating layer is designed to be replaceable while the TPG thermal leveler core can be recovered and reused. When the encapsulating layer deteriorates from corrosion or wear, it can be removed and replaced with a new layer, while the intact TPG core is retained and re-encapsulated. This approach maintains system reliability by replacing only the worn protective layer rather than the entire expensive thermal leveler assembly.
Solution Approach 2:
By segmenting the thermal leveler into a reusable TPG core and a replaceable encapsulating layer, the invention enables selective replacement of only the consumable protective layer. This segmentation strategy maintains system reliability by ensuring the thermal management function remains intact while significantly reducing replacement costs compared to replacing the entire thermal leveler assembly.
4Object-affected harmful factors
If encapsulating layers are used to protect thermal leveler, then corrosion resistance is improved, but flatness specification may be compromised due to pitting and deformation
Solution Approach 1:
The encapsulating layer is applied with attention to local quality requirements - providing maximum corrosion protection in areas most susceptible to chemical attack while maintaining precise flatness control in regions critical for thermal contact. The encapsulation process is designed to preserve the underlying TPG surface flatness, ensuring that protective function does not compromise the precision required for effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution extends the life of thermal levelers by enabling their reuse, reducing replacement costs and maintaining thermal performance, while allowing for efficient thermal management in semiconductor processing applications.
Implementation Method 1
The thermal leveler helps to dissipate the heat in the lateral direction and improve the temperature distribution across the entire wafer
Data Source
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Figure 4A~5
Figure 6~8C
AI summary
An apparatus is shown and described herein that is suitable for supporting a substrate in a process chamber or other application and providing a desired thermal leveling profile. The apparatus is configured to provide a thermal leveler that is detachable from the apparatus.