Physical Quantity Detection Device Drive Electrode Segmentation

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Solution Overview

Problem

Existing physical quantity detection devices face issues with electrical noise interference due to overlapping drive electrodes and increased planar size, which affect detection accuracy and miniaturization.

Innovation Solution

The physical quantity detection device design includes a semiconductor element and a vibrator element where the drive electrode does not overlap the semiconductor element, reducing stray capacitance and electrical noise, and is miniaturized by overlapping the detection portion with the semiconductor element, allowing for direct connection of electrodes and reduced wiring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the drive electrode overlaps the semiconductor element in the plan view, then the device can be miniaturized with reduced planar size, but electrical noise generated from the drive electrode interferes with the semiconductor element circuit

Engineering Contradiction:
Improveplanar sizeVSAvoidelectrical noise interference
Core Design Contradiction:
Area of moving objectVSObject-affected harmful factors

Solution Approach 1:

The drive electrode is divided into a first drive electrode and a second drive electrode that are positioned on opposite sides of the semiconductor element. This segmentation allows the drive electrodes to generate necessary electrical fields while being spatially separated from the semiconductor element, reducing electrical noise interference while maintaining compact planar dimensions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A support structure is introduced as an intermediary component between the drive electrodes and the semiconductor element. The support structure provides mechanical support for the drive electrodes while electrically isolating them from the semiconductor element, thereby reducing electrical noise interference while maintaining the overlapping configuration for miniaturization.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of moving object

If the drive electrode is positioned close to the semiconductor element to reduce planar size, then the device is miniaturized, but stray capacitance increases affecting detection accuracy

Engineering Contradiction:
Improveplanar sizeVSAvoiddetection accuracy
Core Design Contradiction:
Area of moving objectVSMeasurement precision

Solution Approach 1:

The support structure serves as an electrical intermediary that isolates the drive electrodes from the semiconductor element. This intermediary reduces stray capacitance between the drive electrodes and the semiconductor element while allowing the components to be positioned close together for miniaturization, thereby preserving detection accuracy.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The support structure is strategically positioned only where needed to provide electrical isolation and mechanical support, rather than covering the entire area. This localized approach reduces stray capacitance in critical regions while maintaining compact overall device dimensions.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If the drive electrode area facing the semiconductor element is reduced to minimize electrical noise, then electrical noise interference is minimized, but the drive portion may become insufficient

Engineering Contradiction:
Improveelectrical noise interferenceVSAvoiddrive capability
Core Design Contradiction:
Object-affected harmful factorsVSPower

Solution Approach 1:

The drive electrode is segmented into multiple sections (first and second drive electrodes) positioned on opposite sides of the semiconductor element. This segmentation allows the total drive capability to be maintained through distributed electrodes, while each individual electrode segment has reduced area facing the semiconductor element, minimizing electrical noise interference.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The drive electrodes are positioned in a different spatial arrangement rather than directly overlapping the semiconductor element. By distributing the drive electrodes on opposite sides and using the support structure for positioning, the drive capability is maintained through three-dimensional spatial arrangement while reducing the projected area facing the semiconductor element, thereby minimizing electrical noise.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration minimizes electrical noise interference, improves detection accuracy, and reduces the device's planar size, enhancing its reliability and sensitivity while maintaining stable vibration characteristics.

Implementation Method 1

electrical noise generated due to a current flowing into the drive portion

Methodology Applied
Scientific EffectElectrical noise: Parasitic Capacitance

Implementation Method 2

a stray capacitance generated between the drive electrode and the semiconductor element

Methodology Applied
Scientific EffectStray capacitance: Capacitance

Data Source

PatentUS10370241B2Physical quantity detection device, electronic apparatus, and moving object
Publication Date: 2019.08.06 SEIKO EPSON CORP
  • US10370241B2 patent drawing
  • US10370241B2 patent drawing
  • US10370241B2 patent drawing

AI summary

A physical quantity detection device includes a semiconductor element and a physical quantity detection vibrator element a portion of which overlaps the semiconductor element in a plan view of the semiconductor element. The physical quantity detection vibrator element includes a drive portion including a drive electrode, and a detection portion. At least a partial region of the drive electrode does not overlap the semiconductor element in the plan view of the semiconductor element.