Detection Panel Scintillator Layout With Fewer Interlayers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods of manufacturing detection panels result in reduced quantum efficiency and resolution due to multiple layers between the scintillator and circuit layer, and the use of a heavy glass substrate that is prone to damage from impact.
Innovation Solution
A method involving flexible boards where a scintillator is directly formed on the circuit layer, with flexible boards serving as supporting layers to improve the detection panel's quality and reduce the number of layers, and using a mechanical peeling method to separate components to avoid defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the scintillator is indirectly formed on the circuit layer through adhering, then the scintillator can be formed on the substrate, but there will be relatively a large number of layers between the scintillator and the circuit layer, and air bubbles are likely to be generated, reducing quantum efficiency and resolution
Solution Approach 1:
The patent extracts and removes the intermediate substrate layer from the structure. By directly forming the scintillator on the circuit layer without using a separate substrate for indirect growth, the patent eliminates multiple intermediate layers and potential air bubbles, thereby improving quantum efficiency and resolution while reducing structural complexity
Solution Approach 2:
The patent merges the substrate function with the circuit layer by directly forming the scintillator on the circuit layer. This integration eliminates the need for separate substrate and adhesive layers, reducing the total number of layers and improving light transmission efficiency
2Manufacturing precision
If the scintillator is directly formed on the glass substrate carrying the circuit layer by evaporation, then the scintillator can be directly grown on the circuit layer, but the glass substrate is heavy and unable to withstand the impact of a fall
Solution Approach 1:
The patent changes the material parameter of the substrate from heavy glass to lightweight flexible materials such as flexible printed circuit boards or thin metal foils. This parameter change maintains the structural support function while significantly reducing weight and improving impact resistance, making the detection panel suitable for wearable and portable applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quantum efficiency and resolution of the detection panel while providing a lightweight, impact-resistant structure, improving overall panel quality.
Implementation Method 1
When the scintillator converts the X-rays it absorbs into visible light
Data Source
AI summary
Disclosed is a method for manufacturing a detection panel, which includes the following steps. A first flexible board is provided, and the first flexible board has a circuit layer. A second flexible board is provided, the first flexible board is fixed on the second flexible board, and the first flexible board is disposed between the circuit layer and the second flexible board. A carrier board is provided, the carrier board is fixed on the second flexible board, and the second flexible board is disposed between the carrier board and the first flexible board. A scintillator is formed on the circuit layer. The carrier board is detached from the second flexible board. The first flexible board and the second flexible board are cut to form the detection panel.