Image Detector Metal Layer Segmentation Reduces Noise

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Solution Overview

Problem

The production yield of TFT arrays in radiation image detectors is hindered by line defects, and the image quality is compromised due to high electronic noise caused by line capacitance in the data lines.

Innovation Solution

The data lines and scan lines are formed using distinct metal layers with insulating films in between, reducing line capacitance and improving production yield while enhancing image quality by minimizing electronic noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If data lines and scan lines are formed in the same metal layer, then manufacturing process is simplified, but line capacitance increases causing high electronic noise and reduced image quality

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidelectronic noise
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent divides the metal layers into separate layers: one metal layer forms the scan lines and charge collecting electrodes, while another metal layer forms the data lines. This segmentation physically separates the data lines from the scan lines, reducing capacitive coupling and line capacitance, thereby decreasing electronic noise and improving image quality.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If data lines and scan lines are formed in the same metal layer, then device structure is simplified, but production yield decreases due to line defects

Engineering Contradiction:
Improvestructure complexityVSAvoidproduction yield
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

By segmenting the conductive lines into separate metal layers (scan lines in one layer, data lines in another layer), the patent eliminates line defects that occur when all lines are formed in a single layer. This segmentation allows independent formation and inspection of each line type, improving production yield despite increased structural complexity.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If data lines and scan lines are formed in the same metal layer, then manufacturing steps are reduced, but line capacitance increases reducing production yield

Engineering Contradiction:
Improvenumber of manufacturing stepsVSAvoidproduction yield of TFT arrays
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent segments the line formation into separate manufacturing steps for different metal layers. Although this increases the number of manufacturing steps, it significantly reduces line capacitance and eliminates line defects, thereby improving the production yield of TFT arrays.

Inventive Principle:
Principle #1Segmentation

4Ease of manufacture

If data lines and scan lines are formed in the same metal layer, then manufacturing process is simpler, but image quality deteriorates due to high electronic noise

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidimage quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

By segmenting the data lines and scan lines into separate metal layers, the patent reduces capacitive coupling and line capacitance, thereby minimizing electronic noise. This improvement in signal quality directly enhances the manufacturing precision and image quality of the detected images.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP2696367B1Image detector and radiation detecting system
Publication Date: 2018.10.24 FUJIFILM CORP
  • EP2696367B1 patent drawingFigure 1
  • EP2696367B1 patent drawingFigure 2
  • EP2696367B1 patent drawingFigure 3

AI summary

The invention provides an image detector capable of improving the quality of detected images by reducing electronic noise, the image detector comprising, a plurality of scan lines (101) disposed in parallel, a plurality of data lines (3) provided so as to cross with the scan lines, thin film transistors (4) connected with the scan and data lines and provided in matrix, sensor sections (103) connected to the thin film transistor and provided in a matrix and a plurality of common lines disposed so as to apply bias voltage commonly to the sensor sections provided in matrix. Each of the scan lines, data lines and common lines are formed by metal layers different from each other and provided with insulating film(s) disposed therebetween.