Detector Vertical Integration for High Resolution
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Solution Overview
Problem
Radiation or particle detectors with high spatial or temporal resolution require large arrays of sensors, which are limited by the area occupancy and complexity of integrated sensor and control circuitry, leading to inefficiencies and increased costs.
Innovation Solution
The detector comprises a semiconductor substrate with a detector element and a separate control circuit substrate, allowing for vertical integration and optimization of each component independently, reducing area usage and enabling more complex control functions without increasing sensor size, and using trenches for optical screening and electrode connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If sensor arrays are integrated with control circuitry on the same substrate, then area occupancy is improved, but device complexity increases
Solution Approach 1:
The patent divides the detector system into separate modules: sensor arrays on one substrate and control circuitry on another substrate. This segmentation allows each module to be optimized independently while maintaining compact overall design, resolving the contradiction between area occupancy and device complexity.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking, placing sensor arrays and control circuitry on different substrates that are vertically integrated. This dimensional change enables high area occupancy while keeping device complexity manageable through modular architecture.
2Measurement precision
If sensor arrays are made larger to achieve high spatial resolution, then measurement precision is improved, but area occupancy deteriorates
Solution Approach 1:
The patent achieves high spatial resolution by increasing the number of sensor elements through vertical stacking rather than lateral expansion. Multiple sensor arrays are stacked in three dimensions, enabling high measurement precision while maintaining compact area occupancy.
3Device complexity
If control circuitry is integrated with sensor arrays, then device complexity is reduced, but reliability deteriorates due to radiation strikes
Solution Approach 1:
The patent separates control circuitry from sensor arrays onto different substrates. This segmentation protects the control circuitry from radiation strikes that affect the sensor arrays, improving reliability while maintaining manageable device complexity through modular design.
Solution Approach 2:
The patent extracts the control circuitry from the sensor array substrate and places it on a separate substrate. This extraction protects the control functions from radiation-induced disruptions while maintaining system integration, resolving the contradiction between device complexity and reliability.
4Measurement precision
If more sensors are added per area to improve spatial resolution, then measurement precision is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the high-density sensor array into multiple smaller modules that are stacked vertically. Each module can be manufactured with standard precision requirements, and the final high-resolution array is achieved through precise stacking and alignment of these modules, reducing individual manufacturing precision requirements.
Solution Approach 2:
The patent achieves high sensor density by stacking multiple sensor modules in three dimensions rather than packing them in a single plane. This approach reduces the manufacturing precision requirements for individual sensors while achieving high overall spatial resolution through the stacked architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the occupancy level of sensor arrays, reduces manufacturing costs, and enhances spatial and temporal resolution by allowing separate optimization of detector elements and control circuits, while preventing disruption from radiation or particle strikes.
Implementation Method 1
detector element (120) for detecting a radiation or a particle
Implementation Method 2
detector element (120) for detecting a radiation or a particle
Implementation Method 3
using trenches for optical screening
Data Source
AI summary
A detector includes a first semiconductor substrate and a second substrate, wherein the first semiconductor substrate includes a detector element for detecting a radiation or a particle and the second substrate includes a control circuit. The detector element extends from a first main surface of the first semiconductor substrate to a second main surface of the first semiconductor substrate.