Developer Dispense Feedback for Uniform Semiconductor Resist Layers

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Solution Overview

Problem

The uneven dispense rate of the developer during the developing process in semiconductor manufacturing leads to poor quality of the resist layer and subsequent semiconductor devices.

Innovation Solution

A semiconductor device manufacturing system with an analysis subsystem that captures developer distribution information, generates an assessment result, and adjusts the rotational speed of a motor and thrust of a pump to ensure uniform developer distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the developer is supplied during the developing process, then the resist layer is developed to create patterns, but uneven dispense rate of the developer causes poor quality of the developed resist layer and adversely affects the quality of the semiconductor device

Engineering Contradiction:
Improvequality of developed resist layerVSAvoiddispense rate of developer
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent implements a feedback mechanism where a sensor detects the actual dispense rate of the developer, and this information is fed back to a controller that adjusts the pump's operation in real-time to maintain the target dispense rate, thereby ensuring uniform developer distribution and high-quality resist layer development

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system dynamically changes operational parameters (pump speed, flow rate) based on detected conditions to maintain optimal developer dispense rate, transforming a static process into a dynamically adjustable one that adapts to varying conditions during the developing process

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250271774A1Method of manufacturing semiconductor device and semiconductor device manufacturing system
Publication Date: 2025.08.28 NAN YA TECH
  • US20250271774A1 patent drawing
  • US20250271774A1 patent drawing
  • US20250271774A1 patent drawing

AI summary

A method of manufacturing a semiconductor device includes supplying a developer on a substrate. A distribution information of the developer on the substrate is captured by a capturing device of an analysis subsystem. An assessment result is generated based on the distribution information by a processor of the analysis subsystem. Whether to perform an adjustment operation is determined based on the assessment result.