Device Cover With Depression Regions for Thermal Management
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Solution Overview
Problem
Consumer devices like set top boxes face challenges in thermal management due to increased heat generation from additional components and size miniaturization, requiring effective cooling solutions that do not increase manufacturing costs.
Innovation Solution
A cover with depression regions for conductive cooling, air inlets and outlets for convective cooling, and a dark tone for radiant cooling, integrated into the device enclosure to manage heat without the need for additional heat sinks or fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional heat generating components are added to increase device functionality, then device functionality is improved, but heat generation increases making thermal management more difficult
Solution Approach 1:
The patent combines the cover structure with integrated heat dissipation features including depression regions, air inlets, and air outlets directly into the cover. This merging of structural and thermal management functions allows multiple heat generating components to be cooled simultaneously through the unified cover design, resolving the contradiction between increased functionality and heat management difficulty.
2Volume of moving object
If device size is reduced for miniaturization, then device compactness is improved, but heat concentration increases making cooling more challenging
Solution Approach 1:
The patent implements localized heat dissipation features including depression regions positioned directly over heat generating components, with air inlets and outlets strategically placed to create localized airflow paths. This local quality approach allows efficient heat removal from specific concentrated heat sources within the compact device volume, resolving the contradiction between miniaturization and heat concentration.
3Temperature
If separate heat sinks and fans are added for thermal management, then cooling effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent designs the cover to perform multiple functions simultaneously: it provides device enclosure, integrates depression regions for conductive cooling, incorporates air inlets and outlets for convective cooling, and can be treated for radiant cooling properties. This multi-functionality eliminates the need for separate heat sinks and fans, achieving effective thermal management while reducing manufacturing cost and simplifying production.
4Temperature
If the cover is treated to increase emissivity for radiant cooling, then heat transfer via radiation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the cover's surface properties by applying a dark or black tone treatment that increases emissivity. This parameter change in the cover's optical properties enhances radiant cooling capability without requiring complex structural modifications. The simple surface treatment approach achieves improved heat transfer via radiation while minimizing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the device within a prescribed temperature range, reducing manufacturing costs by integrating thermal management into the device enclosure, eliminating the need for separate heat sinks and fans, and ensuring safe operation in high ambient temperatures.
Implementation Method 1
Conductive cooling is realized by two or more depression regions in the cover, with each depression region being thermally coupled to one or more heat generating components
Implementation Method 2
Convective cooling of both the heat generating components and the thermally coupled depression regions is realized by judicious placement of air inlets and air outlets through the cover
Implementation Method 3
the cover can be provided in a dark or black tone to increase the emissivity for an increased heat transfer due to radiant cooling
Data Source
Figure 1
AI summary
An electronic device includes a cover for one or more heat generating components, with the cover providing at least a combined conductive, convective, and radiant cooling for the heat generating components while maintaining the device within a prescribed temperature range. Conductive cooling is realized by providing thermal coupling between each of two or more depression regions in the cover and one or more heat generating components. Appropriate placement of air inlets and outlets through the cover provides convective cooling of the heat generating components and the thermally coupled depression regions. Heat from the heat generating components thermally coupled to one depression region is effectively isolated from heat generated by other heat generating components thermally coupled to another adjacent depression region at least in part via the air outlets through an interior region between the two adjacent depression regions. Radiant cooling can also be improved by increasing the emissivity of the device cover material.