Diagonal Bus Bar Connection Reduces Capacitor Inductance
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Solution Overview
Problem
Conventional capacitor devices experience heat generation and reduced reliability due to high inductance, which affects their electric characteristics and lifespan when high voltage or current is applied, as the existing bus bar connection methods do not effectively reduce impedance.
Innovation Solution
A method for connecting bus bars to the sprayed surfaces of capacitor devices by arranging lead frames alternately in diagonal directions, forming a parallel connection and ensuring insulation between bus bars and capacitor devices, thereby reducing inductance and impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bus bar connection methods are used with serial connection of bus bars to sprayed surfaces, then the capacitor device can be assembled with simple structure, but the inductance and impedance remain high causing heat generation and reduced reliability
Solution Approach 1:
The bus bar connection structure is segmented into multiple lead frames arranged alternately on first and second bus bars, with each lead frame connected to sprayed surfaces in diagonal directions. This segmentation reduces the current path length and inductance while distributing the connection points, thereby improving reliability without excessive complexity
Solution Approach 2:
The connection pattern transitions from conventional serial connection to diagonal arrangement in multiple dimensions. Lead frames are arranged alternately in diagonal directions across the capacitor devices, creating a multi-dimensional connection topology that reduces inductance and impedance while maintaining structural organization
2Temperature
If bus bars are connected to reduce inductance through parallel connection, then heat generation is reduced and temperature characteristics improve, but the manufacturing process becomes more complex
Solution Approach 1:
The parallel connection is achieved by segmenting the current path into multiple lead frames connected alternately on first and second bus bars. This segmentation creates multiple parallel current paths that reduce impedance and heat generation while maintaining a systematic assembly process
Solution Approach 2:
Lead frames are pre-arranged in alternating patterns on the bus bars before final assembly to the capacitor devices. This preliminary arrangement ensures optimal diagonal positioning and parallel connection configuration, reducing inductance while simplifying the final assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces inductance and impedance, leading to enhanced heat resistance and reliability of capacitors, extending their lifespan and improving temperature characteristics.
Implementation Method 1
winding or depositing a vapor-deposited metal film on either or both sides of a plastic film
Implementation Method 2
forming polar plates (hereinafter, referred to as 'sprayed surfaces') on both sides of the wound vapor-deposited film by spraying Zn, Zn alloy, tin, or Zn firstly and tin secondarily
Implementation Method 3
the outer case 6 is charged with an insulating material including epoxy, urethane and the like, and the insulating material is cured in the outer case 6
Data Source
AI summary
Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same.A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.