Diamond 3D IC Structures for Heat Extraction in Heterogeneous Chips

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Solution Overview

Problem

Thermal management in integrated circuits (ICs) is challenging due to excessive heat generation, which can cause physical damage, degradation, and electromigration, particularly in high-performance devices like CPUs and GPUs, where traditional semiconductor materials expand and contract with temperature changes, leading to cracks and reduced reliability.

Innovation Solution

A 3D integrated circuit architecture incorporating diamond-based components such as chiplets, interposers, and thermal vias, utilizing low-temperature chemical vapor deposition to form heat extraction pathways, and strategic placement of diamond chiplets for efficient heat redistribution, combined with diamond-based packaging for electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If traditional semiconductor materials are used in high-performance devices, then device performance can be achieved, but excessive heat generation causes thermal stress, material degradation, and reduced reliability

Engineering Contradiction:

Improvedevice performanceVSAvoidthermal management

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

The patent integrates diamond-based thermal management materials with traditional semiconductor chiplets to form a heterogeneous 3D structure. The diamond interposer and thermal vias provide superior thermal conductivity while the semiconductor chiplets maintain computational functionality, creating a composite system that simultaneously achieves high performance and effective heat dissipation

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The diamond interposer serves as a thermal intermediary between the semiconductor chiplets and the heat sink. It provides dedicated thermal pathways through the interposer and thermal vias that conduct heat away from the chiplets without interfering with their electrical operation, effectively mediating the thermal management challenge

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If diamond-based components are integrated into 3D IC architecture, then thermal performance is enhanced, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal performanceVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The thermal management system is segmented into distinct functional components: diamond chiplets for active cooling, diamond interposer for thermal redistribution, and thermal vias for heat extraction pathways. This segmentation allows each component to be optimized and fabricated separately using appropriate processes, then integrated into the final 3D structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs low-temperature chemical vapor deposition (CVD) processes to grow diamond materials at temperatures below 450°C, which is a significant parameter change from traditional high-temperature diamond synthesis. This enables compatibility with standard semiconductor fabrication processes and existing chiplets that cannot withstand high temperatures

Inventive Principle:

Principle #35Parameter changes

3Reliability

If thermal vias are formed through non-diamond chiplets, then heat extraction pathways are created, but structural integrity may be compromised

Engineering Contradiction:

Improveheat extractionVSAvoidstructural integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

Thermal vias are strategically positioned and sized to create localized heat extraction pathways only where thermal management is most critical. The via density and dimensions are optimized to provide sufficient heat removal while preserving the overall structural integrity of the non-diamond chiplets

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal performance by minimizing thermal resistance, reducing hotspots, and improving reliability through efficient heat dissipation and electromagnetic interference protection, while maintaining structural integrity and electrical functionality.

Implementation Method 1

diamond's superior thermal conductivity to intercept and redistribute heat before it reaches sensitive components

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

low-temperature chemical vapor deposition to form heat extraction pathways

Methodology Applied

Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Implementation Method 3

diamond-based packaging for electromagnetic shielding

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20250323117A1Diamond structures for active mixed-signal processing and passive cooling in heterogeneous chips

Publication Date: 2025.10.16 ADVANCED DIAMOND HOLDINGS LLC

AI summary

A vertically stacked 3D integrated circuit structure includes at least two chiplets: a first chiplet formed from a non-diamond semiconductor material, a second chiplet formed from diamond. The diamond chiplet is positioned vertically relative to the first chiplet and is electrically coupled thereto. Thermal vias are formed through one or more of the non-diamond chiplets and include material to form heat extraction pathways. These thermal vias are thermally coupled to a heat-spreading structure, which may include the diamond chiplet, a diamond interposer, or an encapsulating diamond-based packaging layer.