Diamond-Coated CMP Polishing Pad to Prevent SiO2 Clogging

The polishing layer is configured with a concave-convex pattern where different regions have different functions: the convex portions provide polishing action while the concave portions collect and remove slurry and debris. This local differentiation prevents SiO2 film accumulation in specific areas, eliminating clogging and glazing while maintaining high polishing rate.

The polishing layer is designed with a porous structure containing multiple concave portions that act as reservoirs for slurry and debris collection. This porous configuration allows efficient removal of polished materials and prevents accumulation of SiO2 film, thereby preventing clogging and glazing during the polishing process.

The polishing layer is segmented into multiple convex and concave portions, creating a patterned structure that facilitates slurry flow and debris removal. This segmentation is achieved through a straightforward molding process, maintaining ease of manufacture while effectively preventing clogging and glazing to preserve high polishing rate.

The polishing layer features a concave-convex pattern with curved surfaces that facilitate the flow of slurry and removal of debris. The curved geometry is easily formed through conventional molding techniques, combining manufacturing simplicity with effective prevention of SiO2 film accumulation and maintenance of high polishing rate.