Diamond Microfluidic Cooling via CVD Sacrificial Layer
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Solution Overview
Problem
Conventional thermal management techniques for electronic devices often compromise on size, weight, and power consumption (SWaP), and existing cooling systems are not effectively integrated into chip layouts or substrate structures without detrimental impacts.
Innovation Solution
A method of forming diamond microchannel structures using chemical vapor deposition (CVD) on a patterned sacrificial material, which is then selectively removed to create diamond microfluidic channels that can be integrated with electronic devices for efficient heat dissipation, including three-dimensional interconnect structures for multilayer cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management techniques are used, then heat dissipation is achieved, but device size, weight and power consumption are detrimentally affected
Solution Approach 1:
The cooling system is merged with the substrate structure by fabricating diamond microchannels directly within the diamond film that serves as both the substrate and the thermal management component. This integration eliminates the need for separate cooling components, thereby reducing overall device weight while maintaining effective heat dissipation.
Solution Approach 2:
The microchannel cooling structure is nested within the diamond substrate itself. The sacrificial material is patterned on the substrate, diamond is deposited over it, and the sacrificial material is removed to create channels embedded within the substrate structure, allowing the cooling system to be contained within the existing substrate footprint.
2Temperature
If cooling systems are integrated into chip layout or substrate structure, then thermal management is improved, but device complexity increases
Solution Approach 1:
The sacrificial material is patterned on the substrate before diamond deposition, creating a template that guides the formation of microchannels. This preliminary structuring allows the complex three-dimensional channel network to be formed through sequential deposition and removal steps, simplifying the overall fabrication process compared to attempting to create the channels after the substrate is complete.
Solution Approach 2:
The invention transitions from two-dimensional surface cooling to three-dimensional embedded cooling by depositing diamond layers at different heights and removing sacrificial material at various levels. This creates interconnected channels that extend through the substrate thickness, providing thermal management in the vertical dimension while maintaining a compact footprint.
3Productivity
If diamond microchannels are formed using CVD deposition, then thermal conductivity is enhanced, but manufacturing process complexity increases
Solution Approach 1:
The sacrificial material serves as an intermediary that enables the formation of hollow microchannels within the solid diamond structure. By depositing diamond over the patterned sacrificial material and then removing the sacrificial material, the process creates complex internal channels using simple sequential deposition and removal steps, avoiding the need for complex drilling or etching operations.
Solution Approach 2:
The fabrication process is segmented into discrete, manageable steps: patterning sacrificial material, depositing diamond layers, planarizing surfaces, and selectively removing sacrificial material. This segmentation allows each step to be optimized independently and enables the use of standard semiconductor fabrication equipment, reducing overall manufacturing complexity despite the advanced functionality achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The diamond microfluidic cooling system enhances the thermal management of high-power electronic devices, potentially improving performance and reliability by a factor of three or more, while maintaining SWaP efficiency.
Implementation Method 1
depositing a layer of diamond using chemical vapor deposition (CVD) to cover the patterned base layer
Implementation Method 2
The CVD diamond microchannels being configured to distribute a cooling fluid to dissipate heat from the electronic structure
Data Source
AI summary
Methods using chemical vapor deposition (CVD) of diamond deposited on a sacrificial material provide CVD diamond microchannel structures and 3-D interconnection structures of CVD diamond microfluidic channels. The sacrificial material is patterned to define locations and dimensions of the microchannels. The patterned sacrificial material is selectively removed from underneath the chemical vapor deposited (CVD) diamond to form the CVD diamond microchannels. The CVD diamond microchannels are integrated with electronic structures to provide an integral microfluidic cooling system to electronic devices.