Diamond Substrate Peeling Using Laser-Induced Graphite Gaps
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Solution Overview
Problem
Existing methods for manufacturing diamond substrates are inefficient, particularly in the peeling process, which often requires ultrasonic vibrations and immersion in liquids, limiting the process's effectiveness and efficiency.
Innovation Solution
A diamond substrate manufacturing method involving the positioning of a processing laser beam to form a peeling layer with graphite sections and cracks within the diamond ingot, followed by a peeling laser beam that heats the graphite to react with oxygen, creating gaps for efficient substrate separation without the need for ultrasonic vibrations or liquid immersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ultrasonic vibrations are applied for peeling off the diamond substrate, then the peeling process can be performed, but the process complexity and equipment requirements increase
Solution Approach 1:
The patent replaces the mechanical ultrasonic vibration system with a laser-based thermal field system. The laser beam creates a peeling layer through localized heating and graphitization, eliminating the need for complex ultrasonic equipment and liquid immersion systems while achieving effective substrate separation.
Solution Approach 2:
The patent changes the physical state and chemical composition of the diamond substrate by controlling laser parameters (wavelength, power, pulse duration). By adjusting these parameters, the diamond undergoes phase transformation to graphite in the peeling layer, creating a weak interface that enables easy separation without mechanical vibrations.
2Productivity
If conventional peeling methods are used, then substrate separation is achieved, but processing time and energy consumption increase
Solution Approach 1:
The patent employs pulsed laser irradiation with specific duty cycles and pulse widths. The periodic heating and cooling cycles allow controlled graphitization and gap formation, enabling rapid peeling without continuous high-energy input, thus reducing both time and energy consumption.
Solution Approach 2:
The laser processing performs preliminary graphitization and gap formation within the diamond substrate before separation is attempted. This preliminary action creates a pre-weakened interface that requires minimal additional force or time for complete separation, significantly improving overall processing efficiency.
3Ease of operation
If ultrasonic vibrations and liquid immersion are used for peeling, then substrate separation is possible, but the process requires liquid handling and cleaning steps
Solution Approach 1:
The patent replaces liquid-based ultrasonic peeling with a laser-induced thermal field method. The laser creates gaps and weak interfaces through graphitization without requiring any liquid medium, eliminating liquid handling systems, immersion tanks, and subsequent drying/cleaning operations.
Solution Approach 2:
The laser processing method is self-sufficient, creating all necessary separation interfaces through direct energy input into the material. The process generates its own separation mechanism (graphite layer formation and gap creation) without needing external liquid environments or additional cleaning steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient peeling of diamond substrates with improved process efficiency, allowing for dry operation and enhanced manufacturing capabilities, overcoming the limitations of previous techniques.
Implementation Method 1
a peeling layer forming step of applying the processing laser beam to the workpiece while relatively moving the focal point and the workpiece, to form a peeling layer including graphite sections formed through graphitization of portions inside the workpiece
Implementation Method 2
a peeling step of applying a peeling laser beam of such a wavelength as to be transmitted through the diamond and absorbed in graphite to the workpiece, to heat the graphite sections to such a temperature that the graphite sections react with oxygen in an atmosphere
Implementation Method 3
the graphite sections react with oxygen in an atmosphere, thereby causing at least a part of the graphite sections to react with oxygen in the atmosphere to generate carbon dioxide and to form gaps
Data Source
AI summary
A diamond substrate manufacturing method includes a focal point positioning step of positioning a focal point of a processing laser beam of such a wavelength as to be transmitted through diamond to a depth from a first surface of a workpiece including diamond, the depth corresponding to a thickness of a diamond substrate to be manufactured, a peeling layer forming step of applying the processing laser beam to form a peeling layer including graphite sections formed through graphitization of portions inside the workpiece and cracks extending from the graphite sections, and a peeling step of applying a peeling laser beam of such a wavelength as to be transmitted through diamond and absorbed in graphite, to heat the graphite sections, thereby causing at least a part of the graphite sections to react with oxygen in the atmosphere to generate carbon dioxide and to form gaps, and peeling off the diamond substrate from the workpiece with the gaps as a starting point.