Die Alignment Member for Residue-Free Semiconductor Die Fixing
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Solution Overview
Problem
Existing semiconductor die fixation methods using adhesive tapes result in residue on substrates and dies, and wet paste approaches lead to voids and degraded joint quality due to fluid migration.
Innovation Solution
A non-adhesive die alignment member with openings is used on a metallized substrate surface, allowing dies to be securely positioned and attached via a joining material without adhesive residue, and withstands elevated temperatures and pressures during the joining process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive tape is used to secure dies to substrate during transport and joining, then die displacement is prevented, but residue remains on substrate and dies after joining process
Solution Approach 1:
The harmful adhesive tape is completely removed from the system. Instead, a non-adhesive die alignment member with openings is used to hold dies during transport and joining, eliminating the source of residue while maintaining die positioning capability
Solution Approach 2:
A die alignment member serves as an intermediary component between the substrate and dies during transport and joining. This member provides mechanical support and positioning without using adhesive, allowing clean removal after the joining process
2Reliability
If wet paste is used for die joining, then die attachment is achieved, but fluid migrates toward die edge causing voids and degraded joint quality
Solution Approach 1:
The die alignment member is placed on the substrate before die attachment, creating a controlled environment for paste application. The openings in the alignment member restrict paste flow to specific areas, preventing fluid migration toward die edges before the joining process begins
Solution Approach 2:
The die alignment member creates localized paste application zones through its openings. This ensures paste is confined to specific areas where dies need to be attached, preventing unwanted fluid migration and void formation while maintaining effective die attachment
3Reliability
If adhesive tape is used to hold dies, then die positioning is maintained, but additional cleaning steps are required to remove residue
Solution Approach 1:
The adhesive tape component is completely extracted from the process. The die alignment member provides positioning functionality without adhesive, eliminating the need for subsequent cleaning operations to remove residue
Solution Approach 2:
The die alignment member is designed as a disposable or single-use component that is discarded after one use, eliminating the need for cleaning and reuse. This approach is more cost-effective than investing in complex cleaning processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method eliminates residue issues and ensures high-quality joint formation by preventing die displacement and fluid migration, maintaining the integrity of the sinter layer and substrate.
Implementation Method 1
attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure
Data Source
AI summary
A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.