Die Bonder Intermediate Stage with Protrusions for Reliable Mounting
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Solution Overview
Problem
Die bonder systems face challenges in reliably mounting and picking up semiconductor dies due to the strong adsorbent nature of die attach film, which can absorb foreign substances, leading to cracks or voids, and the risk of the die adhering to the intermediate stage, causing picking issues or stress-induced damage.
Innovation Solution
The implementation of an intermediate stage with an uneven pattern featuring mounting support protrusions and recesses, where the contact surfaces of the protrusions cover 10% or less of the die's back surface area, and optionally including plane keeping protrusions to reduce flexure, along with a heated bonding head for improved adhesion and reduced foreign substance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die is placed on a flat intermediate stage surface, then the die attach film contacts the surface for stable mounting, but foreign substances are absorbed by the die attach film causing cracks or voids
Solution Approach 1:
The intermediate stage surface is designed with local quality variation through protrusions and recesses. The protrusions provide localized contact points that support the die while the recesses create areas where foreign substances can be trapped rather than absorbed by the die attach film, thus maintaining stable mounting while preventing harmful absorption
Solution Approach 2:
The flat intermediate stage surface is segmented into multiple protrusions and recesses. This segmentation reduces the continuous contact area between the die attach film and the stage surface, allowing foreign substances to be confined in recesses rather than being absorbed across the entire contact area, thereby preventing cracks and voids
2Reliability
If the die is left on the intermediate stage for a long period, then the die attach film provides strong adhesion for stable holding, but the die clings to the stage making pickup difficult or causing cracks
Solution Approach 1:
The intermediate stage uses localized protrusions rather than a flat surface, creating discrete contact points. This local quality design allows the die to be held stably during processing while reducing the overall adhesion strength compared to a flat surface, enabling easier pickup without causing cracks due to excessive clinging force
3Ease of operation
If a coating is applied on the intermediate stage surface to prevent die cling, then the die can be easily picked up, but the coating peels off creating foreign substances
Solution Approach 1:
The harmful coating layer is completely removed from the intermediate stage surface. Instead of applying a coating to prevent die cling, the invention extracts this problematic element entirely and replaces it with a geometric solution (protrusions and recesses) that provides both stable holding and easy pickup without generating foreign substances from coating peeling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable mounting and picking up of dies by minimizing contact area and foreign substance absorption, reducing the likelihood of cracks and voids, and eliminating the need for cooling the bonding head, thereby enhancing productivity.
Implementation Method 1
mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place
Implementation Method 2
a heated bonding head for improved adhesion
Data Source
AI summary
A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.